IP Library Assignment 014223/0167
Patent Assignment
Reel/Frame 014223/0167

Assignment of Assignor's Interest

Recorded: 2003-06-20 Pages: 4
Assignors
NAKAMURA, HIROFUMI
Executed: 2003-06-19
ARAI, SATOSHI
Executed: 2003-06-19
Assignees
NEC TOPPAN CIRCUIT SOLUTIONS, INC.
2-7, YAESU 2-CHOME, CHUO-KU, TOKYO, JAPAN
NEC TOKIN CORPORATION
7-1, KORIYAMA 6-CHOME, TAIHAKU-KU, SENDAI-SHI MIYAGI, JAPAN
Covered Property (1)
Printed Circuit Board, Method for Producing Same and Semiconductor Device
Patent: 6,882,544 →
Application: 10/602,828 →
Publication: US 2004/0246690
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address Apr 21, 2017
From: KYOCERA CIRCUIT SOLUTIONS, INC
To: KYOCERA CIRCUIT SOLUTIONS, INC
Reel/Frame 042303/0889 →
Merger Apr 21, 2017
From: KYOCERA CIRCUIT SOLUTIONS, INC.
To: KYOCERA CORPORATION
Reel/Frame 042522/0699 →