Patent Assignment
Reel/Frame 013438/0175
Assignment of Assignor's Interest
Recorded: 2002-10-30
Pages: 2
Assignor
NEC CORPORATION
Executed: 2002-10-01
Assignee
NEC TOPPAN CIRCUIT SOLUTIONS, INC.
2-2-7 YAESU, CHUO-KU, TOKYO, 104-0028, JAPAN
Covered Property
(1)
Mounting Substrate with a Solder Resist Layer and Method of Forming the Same
Patent:
6,420,255 →
Application:
09/484,857 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 31, 2000
From: TAKAHASHI, HISAYA
To: NEC CORPORATION
Reel/Frame 010669/0671 →
Change of Address
Apr 21, 2017
From: KYOCERA CIRCUIT SOLUTIONS, INC
To: KYOCERA CIRCUIT SOLUTIONS, INC
Reel/Frame 042303/0889 →
Merger
Apr 21, 2017
From: KYOCERA CIRCUIT SOLUTIONS, INC.
To: KYOCERA CORPORATION
Reel/Frame 042522/0699 →