Patent Assignment
Reel/Frame 010669/0671
Assignment of Assignor's Interest
Recorded: 2000-03-31
Pages: 3
Assignor
TAKAHASHI, HISAYA
Executed: 2000-01-17
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Mounting Substrate with a Solder Resist Layer and Method of Forming the Same
Patent:
6,420,255 →
Application:
09/484,857 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 30, 2002
From: NEC CORPORATION
To: NEC TOPPAN CIRCUIT SOLUTIONS, INC.
Reel/Frame 013438/0175 →
Change of Address
Apr 21, 2017
From: KYOCERA CIRCUIT SOLUTIONS, INC
To: KYOCERA CIRCUIT SOLUTIONS, INC
Reel/Frame 042303/0889 →
Merger
Apr 21, 2017
From: KYOCERA CIRCUIT SOLUTIONS, INC.
To: KYOCERA CORPORATION
Reel/Frame 042522/0699 →