Collective printed circuit board
View Patent ↗There is provided a collective printed circuit board including a plurality of printed circuit boards each having a mounting unit on which a semiconductor element is mounted at an upper-surface central portion, and a frame having a plurality of through holes having sizes to surround the mounting portion. Upper-surface peripheral edge portions of the printed circuit boards and a through-hole peripheral portion of the frame are bonded to each other such that the mounting units are exposed from the through holes.
1. A collective printed circuit board comprising:
a plurality of printed circuit boards, each having a mounting portion, on which a semiconductor element is mounted, at an upper-surface central portion, having a frame connection pad in an upper-surface outer peripheral portion, and having a solder resist layer containing a resin having an opening exposing the frame connection pad on the surface of the printed circuit boards; and
a frame having a plurality of through holes having sizes to surround the mounting portions, having a connection conductor around the through holes, and having a solder resist layer containing a resin having an opening exposing the connection conductor on the surface of the frame, wherein
upper-surface peripheral edge portions of the printed circuit boards and a through-hole peripheral portion of the frame are bonded to each other such that the mounting portions are exposed from the through holes,
the frame connection pad and the connection conductor are bonded to each other by a conductive bonding material, and
at least a portion between the solder resist layer on the side of the frame and the solder resist layer on the side of the printed circuit boards is bonded by a sealing resin.
2. The collective printed circuit board according to claim 1 , wherein the semiconductor element is mounted on the mounting portion of the printed circuit board.
3. The collective printed circuit board according to claim 1 , wherein the sealing resin is filled in a gap between the printed circuit board and the semiconductor element mounted on the printed circuit board.
4. The collective printed circuit board according to claim 1 , wherein
an electronic part having a height enough to project from an upper surface of the frame is mounted on an upper surface of the printed circuit board in the through hole, and
a second printed circuit board having an opening or a recessed portion adapted to house a portion projecting from the frame of the electronic part at a position corresponding to the electronic part is bonded to the upper surface of the frame.
5. The collective printed circuit board according to claim 1 , wherein
at least one of a plurality of through holes and trenches is formed at a position corresponding to a bonding portion between the frame and the printed circuit board, and
a second printed circuit board having a second through hole at positions corresponding to the through holes and the trenches is bonded to the upper surface of the frame without completely closing the through hole.
6. The collective printed circuit board according to claim 1 , wherein a surface opposing the bonding portion between the frame and the printed circuit board has an external connection pad to which an external electric circuit board is connected.
7. The collective printed circuit board according to claim 1 , further comprising a second printed circuit board bonded to an upper surface of the frame to close the opening of the frame, wherein
a third printed circuit board having a layer configuration or a material different from that of the frame is bonded between the printed circuit board and the second printed circuit board inside the opening.
8. The collective printed circuit board according to claim 7 , wherein the frame is a buildup multi-layered board, and the third printed circuit board is a through hole board.
9. The collective printed circuit board according to claim 7 , wherein
a heat conductivity of the third printed circuit board is higher than a heat conductivity of the frame.
10. The collective printed circuit board according to claim 1 , further comprising a second printed circuit board bonded to an upper surface of the frame through a solder bump to cover the opening of the frame, wherein
a flow path for the sealing resin is formed from the upper surface of the frame or an upper surface of the second printed circuit board to a portion between the frame and the second printed circuit board and a portion between the printed circuit board and the frame, and
the sealing resin flows through the flow path from the upper surface of the frame or the upper surface of the second printed circuit board to the portion between the frame and the second printed circuit board and the portion between the printed circuit board and the frame to perform filling of the sealing resin.
11. The collective printed circuit board according to claim 10 , wherein the flow path is formed by at least one of a trench, a through hole, and a convex stripe.