Wiring board and probe card using the same

1. A wiring board comprising:

a core substrate; and

a buildup layer formed on the core substrate,

wherein the buildup layer includes:

a plurality of resin layers laminated on the core substrate;

a plurality of pads formed on a topmost layer of the resin layers and to which a plurality of probes are respectively connected;

a plurality of wiring conductors formed on either the resin layers or the core substrate and electrically connecting the plurality of pads individually to an external circuit;

a via conductor penetrating through the resin layer in a thickness direction thereof and electrically connecting the pad and the wiring conductor together; and

a dummy via conductor penetrating through the resin layer in the thickness direction thereof without electrically connecting the pad and the wiring conductor together,

wherein the via conductor and the dummy via conductor are arranged immediately below each of the pads,

the pads include a first pad with at least one of the dummy via conductors arranged immediately therebelow, and a second pad with only the via conductor arranged immediately therebelow, and

wherein a total amount of the dummy via conductors and a quantity of the via conductors formed immediately below the first pad is equal to an amount of the via conductors formed immediately below the second pad.

2. The wiring board according to claim 1 ,

wherein the plurality of wiring conductors include a first wiring conductor electrically connected to the first pad, and a second wiring conductor positioned in a layer different from a layer in which the first wiring conductor is positioned and electrically connected to the second pad.

3. The wiring board according to claim 1 ,

wherein the first dummy via conductor and the first via conductor formed immediately below the first pad are distanced away from each other with the resin layer interposed therebetween.

4. The wiring board according to claim 1 ,

wherein the first dummy via conductor and the first via conductor formed immediately below the first pad are electrically connected to each other.

5. The wiring board according to claim 1 ,

wherein either the first dummy via conductor, or the first dummy via conductor and the first via conductor are formed in each of all the resin layers immediately below the first pad.

6. The wiring board according to claim 2 ,

wherein the first wiring conductor is positioned in the same layer as the first pad, and the via conductor is not formed immediately below the first pad.

7. A probe card comprising:

the wiring board according to claim 1 ; and

the plurality of probes individually connected to the plurality of pads.