A wiring board includes a base wiring board 10 and a frame wiring board 20 . The base wiring board 10 has an element mounting portion 1 a and a frame-shaped frame joining portion 1 b on the upper surface and a solder resist layer 4 deposited in a portion between the element mounting portion 1 a and the frame joining portion 1 b . In the wiring board 10 , a first joining pad 6 provided in the frame joining portion 1 b and a second joining pad 16 provided in a lower surface of the frame wiring board 20 are joined together via a solder bump H so that a gap may be formed between the frame joining portion 1 b and the frame wiring board 20 . The base wiring board 10 has a resin injection hole 8 penetrating through the base wiring board 10 in the frame joining portion 1 b , and the gap is filled with a sealing resin 18.
1. A wiring board comprising: a base wiring board having an element mounting portion and a frame-shaped frame joining portion surrounding the element mounting portion on an upper surface, and a solder resist layer deposited on the base wiring board in a portion from the element mounting portion to the frame joining portion; and a frame wiring board which is joined to the frame joining portion and surrounds the element mounting portion,
wherein a first joining pad provided in the frame joining portion of the base wiring board and a second joining pad provided in a lower surface of the frame wiring board are joined together via a solder bump so that a gap is formed between the frame joining portion of the base wiring board and the frame wiring board, and
the base wiring board has a resin injection hole penetrating through the base wiring board in the frame joining portion, and the gap is filled with a sealing resin.
2. The wiring board according to claim 1 , wherein the base wiring board further comprises a frame-shaped protrusion formed on the solder resist layer within the frame joining portion, the resin injection hole penetrates through the protrusion, and a gap formed between the protrusion and the frame wiring board is filled with the sealing resin.
3. The wiring board according to claim 2 , wherein the protrusion is formed by a solder resist layer.
4. A semiconductor element housing wiring board comprising: a base wiring board having an element mounting portion and a frame-shaped cap joining portion surrounding the element mounting portion on an upper surface, and a solder resist layer deposited on the base wiring board in a portion from the element mounting portion to the cap joining portion; a semiconductor element mounted in the element mounting portion; and a cap wiring board which is joined to the cap joining portion and has a cavity, in which the semiconductor element is housed, between the cap wiring board and the upper surface of the base wiring board,
wherein a first joining pad provided in the cap joining portion of the base wiring board and a second joining pad provided in a lower surface of the cap wiring board are joined together via a solder bump so that a gap is formed between the cap joining portion of the base wiring board and the cap wiring board,
the base wiring board has a resin injection hole penetrating through the base wiring board in the cap joining portion, and the gap is filled with a sealing resin.
5. The semiconductor element housing wiring board according to claim 4 , wherein the base wiring board further comprises a frame-shaped protrusion formed on the solder resist layer within the cap joining portion, the resin injection hole penetrates through the protrusion, and a gap formed between the protrusion and the cap wiring board is filled with the sealing resin.
6. The semiconductor element housing wiring board according to claim 5 , wherein the protrusion is formed by a solder resist layer.