A wiring board according to the present invention is provided with an insulating board and a connection pad, wherein the connection pad includes a main conductor layer formed of a low resistance material, a thin film resistor layer formed of a high resistance material and having a low soldering wettability, and a covering layer having a high soldering wettability, the main conductor layer, the thin film resistor layer, and the covering layer being sequentially laminated at the surface of the insulating layer in such a manner as to be electrically connected in series to each other, and the thin film resistor layer covers a main surface and a side surface of the main conductor layer, and further, a side surface of the thin film resistor layer is exposed from the covering layer.
1. A wiring board comprising:
an insulating board having an insulating layer at a surface thereof; and
a connection pad formed at a surface of the insulating layer,
wherein the connection pad includes
a main conductor layer formed of a low resistance material having a volume resistivity of 100 μΩ·cm or less,
a thin film resistor layer formed of a high resistance material having a volume resistivity of 10 Ω·cm or more and having a low soldering wettability, and
a covering layer having a high soldering wettability,
the main conductor layer, the thin film resistor layer, and the covering layer being sequentially laminated at the surface of the insulating layer in such a manner as to be electrically connected in series to each other, and
the thin film resistor layer covers a main surface and a side surface of the main conductor layer, and further, a side surface of the thin film resistor layer is exposed from the covering layer.
2. The wiring board according to claim 1 , wherein the main conductor layer is formed of copper.
3. The wiring board according to claim 1 , wherein the thin film resistor layer is formed of germanium.