Method of manufacturing a wiring board
View Patent ↗There is provided a method of manufacturing a wiring board, including the steps of: preparing an insulating layer 1 a including a cavity formation region X, and a separable metallic foil M formed of first and second metallic foils M 1 and M 2 ; allowing the separable metallic foil M to adhere to at least a lower face side of the insulating layer 1 a with the first metallic foil M 1 serving as an adhering surface; forming a cavity 2 by digging the insulating layer 1 a and the separable metallic foil M in a cavity formation region X from an upper surface side of the insulating layer 1 a to a depth that does not penetrate the second metallic foil M 2 ; inserting an electronic component D into the cavity 2 , and fixing the electronic component D by a fixing resin J; and peeling off the second metallic foil M 2.
1. A method of manufacturing a wiring board, comprising the steps of:
preparing an insulating layer including a cavity formation region and a wiring formation region surrounding the cavity formation region, and a separable metallic foil formed of a first metallic foil and a second metallic foil which are brought into intimate contact with each other in a separable manner;
allowing the separable metallic foil to adhere to an upper side and a lower side of the insulating layer with the first metallic foil serving as an adhering surface;
forming a blast resist including an opening for exposing the separable metallic foil in the cavity formation region on a surface of the separable metallic foil adhering to the upper side of the insulating layer;
removing by etching the separable metallic foil on the upper side of the insulating layer exposed in the opening of the blast resist;
digging the insulating layer exposed in the opening of the blast resist from above by blasting, and forming a cavity having a depth that reaches the second metallic foil on the lower side of the insulating layer but does not penetrate the second metallic foil;
removing the blast resist from the separable metallic foil on the upper side;
injecting a fixing resin into the cavity;
inserting an electronic component into the cavity into which the fixing resin is injected, and fixing the electronic component by curing the fixing resin;
peeling off the second metallic foil from an intimate contact surface with the first metallic foil; and
forming a wiring conductor using a part of the first metallic foil in the wiring formation region.
2. The method of manufacturing a wiring board according to claim 1 ,
wherein a thickness of the first metallic foil is smaller than a thickness of the second metallic foil.
3. The method of manufacturing a wiring board according to claim 1 ,
wherein, after the second metallic foil is peeled off from the intimate contact surface with the first metallic foil, a through-hole is formed in the insulating layer, and the wiring conductor is formed on a surface and in the through-hole of the insulating layer.
4. The method of manufacturing a wiring board according to claim 3 ,
wherein a second insulating layer is laminated on upper surfaces of the insulating layer and the wiring conductor, a via hole is formed in the second insulating layer, and the wiring conductor is formed in the second insulating layer and the via hole.
5. The method of manufacturing a wiring board according to claim 4 ,
wherein a solder resist layer including an opening in which a part of the wiring conductor is exposed is formed on a surface of the second insulating layer.