WIRING BOARD WITH EMBEDDED DEVICE AND ELECTROMAGNETIC SHIELDING
In a preferred embodiment, a wiring board with embedded device and electromagnetic shielding includes a shielding frame, a semiconductor device, a stiffener, a first build-up circuitry and a second build-up circuitry with a shielding lid. The first and second build-up circuitries cover the semiconductor device, the shielding frame and the stiffener in the opposite vertical directions. The shielding frame and the shielding lid are electrically connected to at least one ground contact pad of the semiconductor device by the first build-up circuitry and can respectively serve as effective horizontal and vertical electromagnetic shields for the semiconductor devices within the aperture of the stiffener.
1 . A wiring board with an embedded device and electromagnetic shielding, comprising:
a semiconductor device that includes an active surface with a plurality of contact pads thereon and an inactive surface opposite to the active surface, wherein the active surface faces a first vertical direction and the inactive surface faces a second vertical direction opposite the first vertical direction;
a shielding frame that serves as a placement guide for the semiconductor device and is in close proximity to and laterally covers and laterally extends beyond peripheral edges of the semiconductor device in lateral directions orthogonal to the vertical directions;
a stiffener that includes an aperture with the semiconductor device and the shielding frame extending thereinto;
a first build-up circuitry that covers the semiconductor device, the shielding frame and the stiffener from the first vertical direction and is electrically connected to the contact pads of the semiconductor device through first conductive vias; and
a second build-up circuitry that covers the semiconductor device, the shielding frame and the stiffener from the second vertical direction and includes a shielding lid that is aligned with the semiconductor device, wherein the shielding lid and the shielding frame are electrically connected to at least one of the contact pads for grounding through the first build-up circuitry.
2 . The wiring board of claim 1 , wherein the shielding frame includes a continuous or discontinuous metal strip or an array of metal posts.
3 . The wiring board of claim 1 , wherein the shielding lid is a continuous metal layer and laterally extends beyond peripheral edges of the semiconductor device outward.
4 . The wiring board of claim 1 , wherein the shielding frame is electrically connected to the first build-up circuitry through an additional first conductive via of the first build-up circuitry.
5 . The wiring board of claim 1 , wherein the shielding lid is electrically connected to the first build-up circuitry through a plated through hole that extends through the stiffener.
6 . The wiring board of claim 1 , wherein the shielding lid is electrically connected to the first build-up circuitry through the shielding frame and a second conductive via of the second build-up circuitry.
7 . The wiring board of claim 1 , wherein the shielding lid is electrically connected to the first build-up circuitry through the shielding frame and a conductive trench of the second build-up circuitry.
8 . A wiring board with an embedded device and electromagnetic shielding, comprising:
a shielding lid;
a semiconductor device that is mounted on the shielding lid by an adhesive and includes an active surface with a plurality of contact pads thereon and an inactive surface opposite to the active surface, wherein the active surface faces a first vertical direction away from the shielding lid and the inactive surface faces a second vertical direction toward the shielding lid;
a shielding frame that extends from the shielding lid in the first vertical direction and serves as a placement guide for the semiconductor device and is in close proximity to and laterally covers and laterally extends beyond peripheral edges of the semiconductor device in lateral directions orthogonal to the vertical directions;
a stiffener that includes an aperture with the semiconductor device and the shielding frame extending thereinto; and
a first build-up circuitry that covers the semiconductor device, the shielding frame and the stiffener from the first vertical direction and is electrically connected to the contact pads of the semiconductor device through first conductive vias, wherein the shielding lid and the shielding frame are electrically connected to at least one of the contact pads for grounding through the first build-up circuitry.
9 . The wiring board of claim 8 , further comprising:
a second build-up circuitry that covers the shielding lid and the stiffener from the second vertical direction; and
a plated through hole that extends through the stiffener to provide an electrical connection between the first build-up circuitry and the second build-up circuitry.