Polyamide molding material and moldings manufactured from same

1. A polyamide molding material having the following composition:

(A) 27 to 84.99% by weight of a polyamide mixture comprising

(A1) at least one partially aromatic, partially crystalline polyamide differing from copolyamide 6.T/6 and having a melting point in the range from 255 to 330° C.; and

(A2) at least one copolyamide 6.T/6 having a content of caprolactam of at least 50% by weight,

wherein the sum of the caprolactam contained in polyamide (A1) and copolyamide (A2), amounts to 3 to 18% by weight with reference to the polyamide mixture;

(B) 15 to 65% by weight of at least one filling and strengthening agent;

(C) 0.01 to 3.0% by weight of at least one heat stabilizer;

(D) 0 to 5.0% by weight of at least one additive,

wherein the sum of components (A) to (D) amounts to 100% by weight, and wherein no metal salts and/or metal oxides of a transition metal of the group VB, VIB, VIIB or VIIIB of the periodic system are present in the polyamide molding material.

2. The polyamide molding material in accordance with claim 1 , wherein the polyamide molding material contains 30 to 79.9% by weight of the polyamide mixture (A).

3. The polyamide molding material in accordance with claim 1 , wherein the polyamide molding material has a storage modulus of >1000 MPa at temperatures of at least 93° C.

4. The polyamide molding material in accordance with claim 1 , wherein the at least one partially aromatic, partially crystalline polyamide (A1) has a melting point in the range from 270 to 325° C., and/or a glass transition temperature in the range from 90 to 140° C.

5. The polyamide molding material in accordance with claim 1 , wherein the at least one partially aromatic, partially crystalline polyamide (A1) has a solution viscosity η rel of at most 2.6.

6. The polyamide molding material in accordance with claim 1 , wherein the at least one partially aromatic, partially crystalline polyamide (A1) is manufactured from

a) dicarboxylic acids which contain at least 50 mol % terephthalic acid with respect to the total quantity of the dicarboxylic acids;

b) diamines which contain at least 80 mol % aliphatic diamines having 4 to 18 carbon atoms with respect to the total quantity of the diamines, as well as optionally

c) lactams and/or aminocarboxylic acids,

wherein the copolyamide 6.T/6 is precluded.

7. The polyamide molding material in accordance with claim 1 , wherein the at least one partially aromatic, partially crystalline polyamide (A1) is manufactured from

a) 50 to 100 mol % terephthalic acid and/or naphthalene dicarboxylic acid as well as 0 to 50 mol % of at least one aliphatic dicarboxylic acid having 6 to 12 carbon atoms and/or 0 to 50 mol % of at least one cycloaliphatic dicarboxylic acid having 8 to 20 carbon atoms, and/or 0 to 50 mol % isophthalic acid, with respect to the total quantity of the dicarboxylic acids,

b) 80 to 100 mol % of at least one aliphatic diamine having 4 to 18 carbon atoms, as well as 0 to 20 mol % of at least one cycloaliphatic diamine, and/or 0 to 20 mol % of at least one araliphatic diamine, with respect to the total quantity of the diamines, as well as, optionally,

c) aminocarboxylic acids and/or lactams each having 6 to 12 carbon atoms.

8. The polyamide molding material in accordance with claim 1 , wherein the at least one partially aromatic, partially crystalline polyamide (A1) is selected from PA 4T/4I, PA 4T/6I, PA 5T/5I, PA 6T/6I, PA 6T/6I/6, PA 6T/66, PA 6T/610, PA 10T/106, PA 6T/612, PA 6T/10T, PA 6T/10I, PA 9T, PA 10T, PA 12T, PA 10T/10I, PA10T/12, PA10T/11, PA 6T/9T, PA 6T/12T, PA 6T/10T/6I, PA 6T/6I/6, PA 6T/6I/12 and mixtures thereof.

9. The polyamide molding material in accordance with claim 1 , wherein the at least one copolyamide 6.T/6 containing caprolactam (A2) has a solution viscosity η rel in the range from 1.6 to 3.0.

10. The polyamide molding material in accordance with claim 1 , wherein the at least one filling and strengthening agent (B) is selected from the group comprising

a) glass fibers and/or carbon fibers;

b) particle-like fillers, and

c) mixtures thereof.

11. The polyamide molding material in accordance with claim 1 , wherein the at least one heat stabilizer (C) is selected from the group comprising

a) compounds of monovalent or divalent copper;

b) stabilizers based on secondary aromatic amines;

c) stabilizers based on sterically hindered phenols;

d) phosphites and phosphonites as well as

e) mixtures thereof.

12. A polyamide molding material having the following composition:

(A) 27 to 79.9% by weight of a polyamide mixture comprising

(A1) PA 6T/6I/6, and

(A2) at least one copolyamide 6.T/6 having a content of caprolactam of at least 50% by weight,

wherein the sum of the caprolactam contained in polyamide (A1) and copolyamide (A2), amounts to 8 to 18% by weight with reference to the polyamide mixture;

(B) 20 to 65% by weight glass fibers as well as phyllosilicates;

(C) 0.1 to 3.0% by weight of a heat stabilizer containing at least one compound of the monovalent or divalent copper;

(D) 0 to 5.0% by weight of at least one additive,

wherein the sum of components (A)-(D) amounts to 100% by weight.

13. A molding manufactured from a polyamide molding material in accordance with claim 1 .

14. The polyamide molding material in accordance with claim 1 , wherein the sum of the caprolactam contained in polyamide (A1) and copolyamide 6.T/6 (A2) amounts to 5 to 18% by weight with respect to the polyamide mixture.

15. The polyamide molding material in accordance with claim 14 , wherein the sum of the caprolactam contained in polyamide (A1) and copolyamide 6.T/6 (A2) amounts to 7 to 18% by weight with respect to the polyamide mixture.

16. The polyamide molding material in accordance with claim 2 , wherein the polyamide molding material contains 35 to 70% by weight of the polyamide mixture (A).

17. The polyamide molding material in accordance with claim 3 , wherein the polyamide molding material has a storage modulus of >1000 MPa at temperatures of at least 98° C.

18. The polyamide molding material in accordance with claim 4 , wherein the at least one partially aromatic, partially crystalline polyamide (A1) has a melting point in the range from 280 to 320° C., and/or a glass transition temperature in the range from 110 to 140° C.