Eddy current array configuration with reduced length and thickness

1. An eddy current array probe assembly configured to perform eddy current inspection of a test object with a test surface, the assembly comprising:

a thin-film eddy current array of coils configured to be placed parallel and against the test surface, and a corresponding eddy current circuitry operable to excite and receive eddy current from the array of coils, the array of coils forming at least a first inspection channel and a second inspection channel,

wherein the first inspection channel further comprising a first pair of driver coils and receiver coils, wherein centers of the first pair of driver coils form a first driver sensitivity area and centers of the first pair of receiver coils form a first receiver sensitivity area; wherein, in a plan view taken in a direction towards the test surface, the first driver sensitivity area and the first receiver sensitivity area cross and are orthogonal to each other;

wherein the second inspection channel further comprising a second pair of driver coils and receiver coils, wherein centers of the second pair of driver coils form a second driver sensitivity area and centers of the second pair of receiver coils form a second receiver sensitivity area; wherein, in a plan view taken in a direction towards the test object, the second driver sensitivity area and the second receiver sensitivity area cross and are orthogonal to each other;

wherein the eddy current circuitry is configured and operable in a way that the one of the first pair of driver coils is usable as one of the second pair of driver coils; and one of the first pair of receiver coils is useable as one the second pair of receiver coils.

2. The eddy current array probe assembly in claim 1 ,

wherein the first pair of driver coils are a pair of substantially identical, yet reversely wound driver coils and the first pair of receiver coils comprising a pair of substantially identical, differentially connected receiver coils; and,

wherein the second pair of driver coils are a pair of substantially identical, yet reversely wound driver coils and the second pair of receiver coils comprising a pair of substantially identical, differentially connected receiver coils.

3. The eddy current array probe assembly in claim 1 ,

wherein the eddy current circuitry is configured to excite the first pair of driver coils to cause an eddy current flow in the test object to be in a pattern of a pair of substantially identical yet reversely wound swirls; and,

the eddy current circuitry is configured to excite the second pair of driver coils to cause an eddy current flow in the test object to be in a pattern of a pair of substantially identical yet reversely wound swirls.

4. The eddy current array probe assembly in claim 1 , wherein the first pair of driver coils and receiver coils are over-laid on top of each other and the second pair of driver coils and receiver coils are over-laid on top of each other.

5. The eddy current array probe assembly in claim 1 , wherein the array of coils is of a type fabricated using printed circuit board manufacturing technologies.

6. The eddy current array probe assembly in claim 1 , wherein each of at least some of the array coils comprises at least first and second separate coil portions, each portion being wound in the same direction, driven independently with a 180 degree phase difference, the two coil portions being disposed on the same plane parallel to the test surface.

7. The eddy current array probe assembly in claim 1 , wherein the array coils are formed by employing one of the array coils multiplied into a plurality of identical 2D coils arranged in a staggered manner in a series and/or in multiple layers.