Integrated Group III-V Power Stage
In one implementation, an integrated group III-V power stage includes a control switch including a first group III-V transistor coupled to a sync switch including a second group III-V transistor. The integrated group III-V power stage may also include one or more driver stages, which may be fabricated in a group die or dies. The driver stage or driver stages, the control switch, and the sync switch may all be situated in a single semiconductor package.
1 . A power stage comprising:
a control switch including a first group III-V transistor coupled to a sync switch including a second group III-V transistor;
a driver stage;
said driver stage, said control switch, and said sync switch of said power stage being situated in a single semiconductor package.
2 . The power stage of claim 1 , wherein said driver stage is configured to drive both said control switch and said sync switch.
3 . The power stage of claim 1 , wherein said driver stage is configured to drive one of said control switch and said sync switch, and another driver stage is configured to drive the other of said control switch and said sync switch.
4 . The power stage of claim 1 , wherein said control switch and said sync switch are integrated in a single semiconductor die.
5 . The power stage of claim 1 , wherein said driver stage is fabricated in a group III-V semiconductor die.
6 . The power stage of claim 1 , wherein said driver stage, said control switch, and said sync switch are integrated in a single semiconductor die.
7 . The power stage of claim 1 , wherein at least one of said first group III-V transistor and said second group III-V transistor is a depletion mode (normally ON) group III-V transistor.
8 . The power stage of claim 1 , wherein at least one of said first group III-V transistor and said second group III-V transistor is an enhancement mode (normally OFF) group III-V transistor.
9 . The power stage of claim 1 , wherein at least one of said control switch and said sync switch is a composite switch, said composite switch including a respective one of said first group III-V transistor and said second group III-V transistor cascoded with a low voltage (LV) group IV transistor.
10 . The power stage of claim 9 , wherein at least one of said first group III-V transistor and said second group III-V transistor, and at least one of said LV group IV transistors, are monolithically integrated.
11 . The power stage of claim 9 , wherein at least one of said first group III-V transistor and said second group III-V transistor, and at least one of said LV group IV transistors, are die-stacked integrated.
12 . The power stage of claim 1 , wherein an input inductor and an output capacitor are situated in said single semiconductor package.
13 . The power stage of claim 1 , wherein said single semiconductor package comprises a quad-flat no-leads (QFN) package.
14 . The power stage of claim 1 , wherein said single semiconductor package comprises a laminate package.
15 . The power stage of claim 1 , wherein at least one of said first group III-V transistor and said second group III-V transistor is a bi-directional dual gated group III-V transistor.
16 . The power stage of claim 1 , wherein said control switch and said sync switch are composite switches and wherein said first group III-V transistor and said second group III-V transistor are formed on a common die.
17 . The power stage of claim 1 , wherein at least one gate drive of said driver stage is integrated with at least one of said first group III-V transistor and said second group III-V transistor.
18 . The power stage of claim 1 , wherein at least one of said first group III-V transistor and said second group III-V transistor is formed over a group IV substrate.
19 . The power stage of claim 1 , wherein at least one of said first group III-V transistor and said second group III-V transistor is formed over a compositionally graded III-Nitride layer.
20 . The power stage of claim 1 , wherein at least one of said first group III-V transistor and said second group III-V transistor is formed over an amorphous strain absorbing layer.