IP Library Granted Patent US 9,429,966
Granted Patent B2
US 9,429,966 · App. 13/979,860 · Granted Aug 30, 2016

Integrated circuit device, voltage regulation circuitry and method for regulating a voltage supply signal

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,429,966
App. No.
13/979,860
Granted
Aug 30, 2016
Kind
B2
Abstract

An integrated circuit (IC) device is provided that includes at least one internal voltage regulator arranged to receive a voltage supply signal at a first input thereof, receive a control signal at a second input thereof, regulate the received voltage supply signal in accordance with the received control signal, and provide a regulated voltage supply signal at an output thereof. The IC device further includes at least one voltage regulation power control module operably coupled to the second input of the at least one internal voltage regulator and arranged to provide the control signal thereto. The voltage regulation power control module is further arranged to receive at least one IC device conditional indication, and generate the control signal for the at least one internal voltage regulator based at least partly on an available thermal power budget for the IC device corresponding to the at least one IC device conditional indication.

Claims (46)

1. An integrated circuit (IC) device comprising:

at least one internal voltage regulator arranged to

receive a voltage supply signal at a first input thereof,

receive a control signal at a second input thereof,

regulate the received voltage supply signal in accordance with the received control signal, and

provide a regulated voltage supply signal at an output thereof;

at least one voltage regulation power control module operably coupled to the second input of the at least one internal voltage regulator and arranged to

provide the control signal thereto,

receive at least one IC device conditional indication, and

generate the control signal for the least one internal voltage regulator based at least partly on an available thermal power budget for the IC device corresponding to the at least one IC device conditional indication, wherein the at least one voltage regulation power control module is arranged to generate the control signal to cause the at least one internal voltage regulator to enter a bypass mode, and, in response to the control signal, the at least one internal voltage regulator provides the received voltage supply signal unregulated at an output thereof, if the available thermal power budget for the IC device corresponding to the at least one IC device conditional indication is less than a threshold value.

2. The IC device of claim 1 further comprising:

at least one external voltage regulator for generating the voltage supply signal received at the first input of the at least one internal voltage regulator, wherein each of the at least one external voltage regulator is operably coupled to a corresponding one of the at least one voltage regulation power control module.

3. The IC device of claim 2 wherein the voltage regulator power control module is arranged to configure the external voltage regulator to output a voltage supply signal regulated to a required voltage level, if the available thermal power budget for the IC device corresponding to the at least one IC device conditional indication is less than a threshold value.

4. The IC device of claim 1 wherein the voltage regulation power control module is arranged to generate a control signal to cause the at least one internal voltage regulator to output a regulated voltage supply signal regulated to a required voltage level, if the available thermal power budget for the IC device corresponding to the at least one IC device conditional indication is greater than the threshold value.

5. The IC device of claim 1 wherein the threshold value corresponds to a required thermal power budget for the at least one internal voltage regulator.

6. The IC device of claim 5 wherein the voltage regulation power control module is further arranged to receive an indication of an operating frequency for the IC device, and to determine a required thermal power budget for the at least one internal voltage regulator based at least partly on the indication of the operating frequency.

7. The IC device of claim 1 wherein the at least one IC device conditional indication comprises at least one from a group consisting of:

an indication of a process corner for the IC device;

an indication of an ambient temperature for the IC device;

an indication of a per junction temperature for the IC device;

an indication of a level of system activity within the IC device;

an indication of a system configuration within the IC device.

8. The IC device of claim 1 wherein the available thermal power budget for the IC device is determined based at least partly on a thermal power limit for the IC device and a determined power consumption for internal System on Chip (SoC) modules for the IC device.

9. The IC device of claim 1 wherein the voltage regulation power control module is further arranged to receive an indication of a required voltage level at which the voltage supply signal is to be regulated.

10. The IC device of claim 1 wherein the at least one internal voltage regulator comprises a low drop-out (LDO) voltage regulator.

11. A method for regulating a voltage supply signal within an integrated circuit (IC) device, the method comprising:

determining a required thermal power budget for the at least one internal voltage regulator; and

configuring at least one internal voltage regulator of the IC device based at least partly on an available thermal power budget for an IC device corresponding to an at least one IC device conditional indication, wherein at least one voltage regulation power control module is arranged to generate a control signal to cause the at least one internal voltage regulator to enter a bypass mode, with the at least one internal voltage regulator providing the received voltage supply signal unregulated at an output of the internal voltage regulator corresponding to the at least one IC device conditional indication indicating the available thermal power budget for the IC device being less than a threshold value.

12. The method of claim 11 wherein the method further comprises:

determining the available thermal power budget for the IC device; and

configuring the at least one internal voltage regulator based at least partly on a comparison between the available thermal power budget for the IC device and the required thermal power budget for the at least one internal voltage regulator.

13. The method of claim 12 further comprising configuring a bypass mode for the at least one internal voltage regulator if the determined required thermal power budget for the at least one internal voltage regulator is greater than the determined available thermal power budget for the IC device.

14. An integrated circuit (IC) device comprising:

at least one internal voltage regulator arranged to

receive a voltage supply signal at a first input thereof,

receive a control signal at a second input thereof,

regulate the received voltage supply signal in accordance with the received control signal, and

provide a regulated voltage supply signal at an output thereof;

at least one voltage regulation power control module operably coupled to the second input of the at least one internal voltage regulator and arranged to

provide the control signal thereto,

receive at least one IC device conditional indication, and

generate, by accessing a look up table, the control signal for the at least one internal voltage regulator based at least partly on an available thermal power budget for the IC device corresponding to the at least one IC device conditional indication, and, in response to the control signal with the available thermal power budget for the IC device corresponding to the at least one IC device conditional indication being less than a threshold value, the at least one internal voltage regulator enters a bypass mode and provides the received voltage supply signal unregulated at an output thereof.

15. The IC device of claim 14 wherein the available thermal power budget for the IC device takes into account variations of an internal voltage regulator available thermal power budget for the at least one internal voltage regulator.

16. The IC device of claim 15 wherein the variations of the internal voltage regulator available thermal power budget result from variations in ambient temperature.

17. The IC device of claim 15 wherein the variations of the internal voltage regulator available thermal power budget result from variations in per junction temperature.

18. The IC device of claim 14 wherein the available thermal power budget for the IC device is based at least partly on a determined power consumption for at least one internal System on Chip (SoC) module.

Assignments (27)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0241. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 5, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041260/0850 →
MERGER Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040652/0241 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PCT NUMBERS IB2013000664, US2013051970, US201305935 PREVIOUSLY RECORDED AT REEL: 037444 FRAME: 0787. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Oct 17, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 040450/0715 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 5, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037444/0787 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0874 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Nov 13, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 031627/0158 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Nov 13, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031627/0201 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 16, 2013
From: PRIEL, MICHAEL; KUZMIN, DAN; ROZEN, ANTON
To: FREESCALE SEMICONDUCTOR INC.
Reel/Frame 030802/0283 →