Ion milling device and ion milling processing method
The sample 3 is tilted/oscillated with respect to the optical axis (Z-axis) of the ion beam 2 to repeat tilt and tilt/restoration of a processing target surface 3 a of the sample 3 between a surface state in which the processing target surface 3 a of the sample 3 faces a tilt axis direction (Y-axis direction) and a tilted surface state in which a portion of the processing target surface 3 a on the sample stage side protrudes in the tilt axis direction (Y-axis direction) than does a portion of the processing target surface 3 on the mask side, so that the processing target surface 3 a is irradiated with the ion beam 2 at a low angle, and projections/recesses 63 derived from a void 61 or a dissimilar material 62 are suppressed. Accordingly, it is possible to suppress generation of projections/recesses derived from a void or dissimilar material in fabrication of a cross section sample, and thus fabricate a sample cross section suitable for observation/analysis.
1. An ion milling device comprising:
a sample table holding a sample that is partially shielded by a mask;
a swinging mechanism that shakes the sample table about a first axis as a tilt axis, the first axis having an axial direction that is perpendicular to an optical axis of an ion beam emitted from an ion beam source; and
a tilt-oscillation mechanism that tilts the sample held on the sample table about a second axis as a tilt axis, the second axis being orthogonal to both the optical axis of the ion beam and the first axis,
wherein the tilt-oscillation mechanism shakes the sample such that a processing target surface of the sample that is formed along the optical axis of the ion beam is repeatedly switched between a first state in which the processing target surface of the sample is oriented along the optical axis of the ion beam and a second state in which the processing target surface of the sample is tilted toward the ion beam source side.
2. The ion milling device according to claim 1 , wherein the tilt-oscillation mechanism includes setting means for changing an angle at which the processing target surface of the sample is made to cross the optical axis of the ion beam in a range from 0 to 20 degrees.
3. The ion milling device according to claim 1 , wherein the tilt-oscillation mechanism includes a stopper portion that regulates a shake so as to prevent the processing target surface of the sample on the mask side from projecting in the axial direction than does the processing target surface on the sample table side.
4. An ion milling processing method comprising:
a cross section producing step of, by shaking a sample table holding a sample that is partially shielded by a mask about a first axis as a tilt axis, the first axis having an axial direction that is perpendicular to an optical axis of an ion beam emitted from an ion beam source, producing a processing target surface of the sample that is defined by the mask and is oriented along the optical axis of the ion beam; and
a smoothing step of smoothing projections or recesses produced on the processing target surface of the sample by execution of the cross section producing step by shaking the sample held on the sample table about a second axis as a tilt axis, the second axis being orthogonal to both the optical axis of the ion beam and the first axis, such that the processing target surface of the sample that is formed along the optical axis of the ion beam is repeatedly switched between a first state in which the processing target surface of the sample is oriented along the optical axis direction of the ion beam and a second state in which the processing target surface of the sample is tilted toward the ion beam source side.
5. The ion milling processing method according to claim 4 , further comprising a step of changing an angle at which the processing target surface of the sample is made to cross the optical axis of the ion beam in a range from 0 to 20 degrees in accordance with a type of the sample to be processed.
6. The ion milling processing method according to claim 4 , wherein the smoothing step is executed concurrently with the cross section producing step at a last stage of processing in the cross section producing step.