Two-part polyurethane adhesive for bonding fiber-reinforced plastics
A two-part polyurethane adhesive system includes a resin component A and a curative B. The resin component A includes a monomeric polyisocyanate and a prepolymer. The curative B includes a of ether polyol having a molecular weight of from 3000 to 20,000 and another polyol having 4-8 hydroxyl groups and a molecular weight of from 200 to 1000. The system includes a tin (IV) catalyst, which is contained in the resin component, and a blocked aza-type catalyst, which is contained in the curative. The system has excellent shelf stability, gives an excellent open time at ambient temperatures, and cures rapidly when heated to 65° C. or higher.
1. A process for bonding a pair of sheet molding compound substrates, comprising
a) mixing together a resin component A and a curative B of a two-component polyurethane system at a mixing ratio such that the mixture contains an excess of isocyanate groups, to form a heat-curable adhesive;
b) applying the heat curable adhesive to a bondline intermediate to the substrates; and
c) heating the heat-curable adhesive to a temperature of at least that at which a blocked aza catalyst becomes activated to cure the heat-curable adhesive and form an adhesive bond between the substrates at the site of the bondline,
wherein each of the resin component A and the curative B are liquids having a Brookfield viscosity of from 5,000 to 50,000 cps at 25° C.,
the resin component A has an isocyanate equivalent weight of from 230 to 350 and comprises (A-1) a mixture of isocyanate compounds, which mixture is liquid at 25° C., has an average isocyanate content of from 15 to 23% by weight and includes a polyisocyanate compound containing from 2 to 4 isocyanate groups per molecule, and which is devoid of urethane or urea linkages and a prepolymer which is a reaction product of at least one polyisocyanate containing from 2 to 4 isocyanate groups per molecule which is devoid of urethane or urea linkages and at least one isocyanate-reactive compound that includes a difunctional polyether polyol having a molecular weight of from 1000 to 3000 and (A-2) at least one tin (IV) catalyst, and
the curative B has an equivalent weight per isocyanate-reactive group of from 250 to 450 and comprises (B-1) at least one polyether polyol which contains from 2 to 4 hydroxyl groups per molecule and has a number average molecular weight of from 3000 to 20,000; (B-2) at least one polyol having from 4 to 8 hydroxyl groups per molecule and a molecular weight of from 200 to 1000 and (B-3) at least one blocked aza catalyst which is heat activatable at a temperature of at least 65° C.,
and further wherein upon adhesion testing the bonded pair of sheet molding compound substrates fails in a fiber tear mode.
2. The process of claim 1 , wherein, in step a, wherein equal volumes of the resin component A and the curative B are mixed in step a) and resin component A contributes from 1.10 to 1.35 isocyanate groups per isocyanate-reactive group contributed by the curative B.
3. The process of claim 2 , wherein no primer is applied to the substrates prior to the application of the heat-curable adhesive.
4. The process of claim 3 , wherein in step c), the temperature is at least 80° C.