Copper alloy wire and copper alloy spring
View Patent ↗A copper alloy wire is a filamentary material of a copper alloy containing, in percent by mass, Ni: 3.0 to 15.0%, Al: 0.5 to 5.0%, and Si: 0.1 to 3.0%, with the remainder being composed of Cu and incidental impurities, which is provided with the tensile strength (σB) of 900 to 1300 MPa and electrical conductivity of 10 to 22% IACS and, in addition to that property, satisfies an intensity ratio of A:B:C of 1.0:1.2 to 6.0:2.2 to 8.0 when A, B and C represent diffraction intensities of Cu (111), Cu (200) and Cu (220), respectively, according to an X-ray diffraction method in a predetermined cross section, and which is used for an operation or contact spring by incorporating in mobile phones and various small electronic instruments by formulating into a copper alloy spring used, particularly, for an electrical conductive spring.
1. A fine copper alloy wire formed of a filamentary material of a copper alloy containing, in percent by mass, Ni: 5.0 to 13.0%, Al: 0.6 to 3.0%, and Si: 0.3 to 1.2%, with the remainder being composed of Cu and incidental impurities,
wherein Ni, Al and Si are contained in the copper alloy so as to satisfy the following relationship:
{(Ni+20Al)/8Si} being 7 to 13,
wherein the fine copper alloy wire has a fibrous texture having a crystal particle diameter of a transverse section of 5 μm or less by cold wire drawing working and is provided with the tensile strength (σB) of 900 to 1300 MPa, and electrical conductivity of 10 to 22% IACS,
wherein the fine copper alloy wire is formed to have a wire diameter of 0.05 to 3 mm by the cold wire drawing working,
wherein the fine copper alloy wire is a precipitation hardening-type copper alloy in which a γ′ phase of Ni 3 (Al, Si) alone is formed in a parent phase thereof, by aging treatment, or a precipitation hardening-type copper alloy in which an intermetallic compound of Ni 2 (Al, Si) and/or an intermetallic compound of Ni 5 Si 2 are formed in a parent phase thereof, in addition to the γ′ phase of Ni 3 (Al, Si), by aging treatment,
wherein a diffraction intensity ratio of A:B:C satisfies 1.0:1.4 to 4.0:2.8 to 5.0, when A represents a diffraction intensity of Cu (111), B represents a diffraction intensity of Cu (200), and C represents a diffraction intensity of Cu (220) according to an X-ray diffraction method in a predetermined cross section of the fine copper alloy wire,
wherein the fine copper alloy wire has a proof stress ratio (σ0.2/σB) of the tensile strength relative to a 0.2% proof stress (σ0.2) of 68 to 85%, and
wherein the fine copper alloy wire optionally further contains one or two or more of, in percent by mass,
B: 0.001 to 0.050%
P: 0.01 to 0.30%
Ti: 0.1 to 0.8%
Co: 0.1 to 0.8%
Zn: 0.3 to 1.2%
Sn: 0.1 to 1.0% and
Fe: 0.01 to 1.0%.
2. A copper alloy spring having a predetermined spring shape due to a fine copper alloy wire, wherein the copper alloy spring uses the fine copper alloy wire as defined in claim 1 , and is such that electrical conductivity is 12 to 22% IACS, and a residual shearing strain measured in a heat sagging test, when the spring is heated to 125° C. and held for one week in the state where a stress of 400 N/mm 2 is loaded, is 0.15% or less, and wherein the intermetallic compound has an average particle diameter of 4 μm or less, and an occupying area ratio in a range of 0.05 to 30%.