IP Library Granted Patent US 9,190,243
Granted Patent B2
US 9,190,243 · App. 14/012,019 · Granted Nov 17, 2015

Composite charged particle beam apparatus and thin sample processing method

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Quick Facts
Patent No.
US 9,190,243
App. No.
14/012,019
Granted
Nov 17, 2015
Kind
B2
Abstract

A composite charged particle beam apparatus includes a FIB column for irradiating a thin sample with a FIB and a GIB column for irradiating the thin sample with a GIB. The thin sample is placed on a sample stage, and a tilt unit tilts the thin sample about a tilt axis of the sample stage, the tilt axis being orthogonal to the FIB irradiation axis and being located inside a plane formed by the FIB irradiation axis and the GIB irradiation axis. A tilt sample holder is mounted on the sample stage and fixes the thin sample such that a cross-sectional surface of the thin sample is tilted at a constant angle with respect to the GIB irradiation axis and the azimuth angle of the GIB column can be changed by rotation of the sample stage.

Claims (19)

1. A composite charged particle beam apparatus, comprising:

a first charged particle beam column configured to irradiate a thin sample with a first charged particle beam;

a second charged particle beam column configured to irradiate an irradiation position of the first charged particle beam of the thin sample with a second charged particle beam;

a sample stage on which the thin sample is placed, the sample stage being rotatable about the irradiation axis of the first charged particle beam column;

a tilt unit configured to tilt the thin sample about a tilt axis of the sample stage, the tilt axis being orthogonal to the irradiation axis of the first charged particle beam column and being located inside a plane formed by the irradiation axis of the first charged particle beam column and the irradiation axis of the second charged particle beam column; and

a tilt sample holder placed on the sample stage and configured to fix the thin sample such that a cross-sectional surface of the thin sample is tilted at a constant angle with respect to the irradiation axis of the second charged particle beam column and the azimuth angle of the second charged particle beam column can be changed by rotation of the sample stage.

2. The composite charged particle beam apparatus according to claim 1 , wherein the tilt sample holder is attachable to and detachable from the sample stage.

3. The composite charged particle beam apparatus according to claim 1 , further comprising:

a display unit configured to display an operation condition and an observation image of the thin sample;

an input unit configured to allow an operator to input information about the operation condition; and

a control unit configured to control the composite charged particle beam apparatus on the basis of the information input to the input unit.

4. A thin sample processing method comprising:

fixing a thin sample to a tilt sample holder mounted on a rotatable sample stage;

forming across-sectional surface on the thin sample by irradiating the thin sample with a first charged particle beam;

performing first finishing processing by irradiating the cross-sectional surface with a second charged particle beam from an upper surface side of the thin sample;

tilting the thin sample about a tilt axis of the sample stage by rotating the sample stage to change the azimuth angle of the second charged particle beam, the tilt axis being orthogonal to an irradiation axis of the first charged particle beam and being located inside a plane formed by the irradiation axis of the first charged particle beam and an irradiation axis of the second charged particle beam; and

performing second finishing processing by irradiating the cross-sectional surface with the second charged particle beam from the upper surface side after the thin sample is tilted.

5. The thin sample processing method according to claim 4 , further comprising:

observing the cross-sectional surface by using SEM observation during the performing the first finishing processing and the second finishing processing.

Assignments (3)
CHANGE OF NAME Recorded Sep 17, 2025
From: HITACHI HIGH-TECH SCIENCE CORPORATION
To: HITACHI HIGH-TECH ANALYSIS CORPORATION
Reel/Frame 072903/0636 →
CHANGE OF ADDRESS Recorded Sep 17, 2025
From: HITACHI HIGH-TECH SCIENCE CORPORATION
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 072909/0223 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2013
From: ASAHATA, TATSUYA; SUZUKI, HIDEKAZU; TORIKAWA, SHOTA
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 031285/0572 →