Self-terminating growth of platinum by electrochemical deposition
View Patent ↗A self-terminating rapid process for controlled growth of platinum or platinum alloy monolayer films from a K 2 PtCl 4 —NaCl—NaBr electrolyte. Using the present process, platinum deposition may be quenched at potentials just negative of proton reduction by an alteration of the double layer structure induced by a saturated surface coverage of underpotential deposited hydrogen. The surface may be reactivated for platinum deposition by stepping the potential to more positive values where underpotential deposited hydrogen is oxidized and fresh sites for absorption of platinum chloride become available. Periodic pulsing of the potential enables sequential deposition of two dimensional platinum layers to fabricate films of desired thickness relevant to a range of advanced technologies, from catalysis to magnetics and electronics.
1. A self-terminating electrodeposition process for controlled growth of platinum monolayer film in an aqueous solution, the process comprising the steps of:
in the aqueous solution, electrodepositing platinum or a platinum alloy onto a substrate such that a saturated underpotential deposited hydrogen layer is formed on the substrate, wherein, as the potential moves negative of an onset of proton reduction potential, a metal deposition reaction among the deposited platinum, the hydrogen layer and the aqueous solution is fully quenched, wherein the aqueous solution contains at least platinum salt; and
pulsing the potential from a first value, a positive value at which no metal deposition occurs, to a second value, said second value being a more negative value than the first value, said second value being at least 0.05 V more negative or below the reversible hydrogen electrode potential of said solution, thus enabling formation on the substrate of two-dimensional platinum islands that substantially cover the substrate, said formation being followed by negligible further metal deposition on the substrate.
2. The process of claim 1 , further comprising the step of:
at least one additional time, pulsing the potential to at least one additional more positive value, to oxidize the hydrogen layer thus permitting sequential deposition of platinum islands to fabricate platinum films of desired thickness;
wherein the number of pulses correspond to the thickness of formed platinum.
3. The process of claim 2 , further comprising the step of:
adjusting a time constant of the electrochemical cell, thereby adjusting the amount of material that is electrodeposited.
4. The process of claim 3 , wherein the adjusting step includes changing electrochemical cell dimensions and/or the supporting electrolyte concentration.
5. The process of claim 1 , wherein the at least platinum salt is a Pt(II) salt as a metal source in a concentration of about 0.0001 mol/L to about 0.05 mol/L, and the aqueous solution further includes one of more alkali or alkaline earth salts as a supporting electrolyte in a concentration of 0 mol/L to about 3 mol/L.
6. The process of claim 1 , wherein the at least platinum salt is Pt(IV) salt as a metal source in a concentration of about 0.0001 mol/L to about 0.05 mol/L and the aqueous solution further includes a supporting electrolyte comprised of one of more alkali or alkaline earth salts in a concentration of 0 mol/L to about 3 mol/L.
7. The process of claim 1 , wherein the substrate includes an electrode and the process further comprises the steps of:
terminating the deposition of the platinum or platinum alloy by removing the electrode from the aqueous solution while the potential is applied; and
rinsing the platinum or platinum alloy with water.
8. The process of claim 1 , further comprising the steps of:
terminating the deposition of the platinum or platinum alloy by stepping the potential to a third value where no platinum dissolution or deposition occurs, the third value being a more positive value than the second value;
removing the platinum or platinum alloy from the aqueous solution; and
rinsing the platinum or platinum alloy with water.
9. The process of claim 1 , wherein the pH value of the aqueous solution is in the range of 1.0 to 14.0.
10. The process of claim 5 , wherein the aqueous solution further includes a pH buffer.
11. The process of claim 6 , wherein the aqueous solution further includes a pH buffer.
12. The process of claim 1 wherein the substrate material is an iron group metal or an alloy thereof.
13. The process of claim 1 , wherein the substrate material is gold, silver, or copper or an alloy thereof.
14. The process of claim 1 , wherein the substrate material is a platinum group metal or an alloy thereof.
15. The process of claim 1 , wherein the substrate material is chromium, tungsten, molybdenum or an alloy thereof.
16. The process of claim 1 , further comprising:
prior to the electrodepositing step, pretreating the substrate to remove an oxidized surface.