Electronic device including interconnects with a cavity therebetween and a process of forming the same
View Patent ↗A process of forming an electronic device can include providing a first interconnect over a substrate having a primary surface, depositing a first insulating layer over the first interconnect, and patterning the first insulating layer to define an opening extending towards the first interconnect. The process can also include depositing a second insulating layer over the first insulating layer to seal the opening and form a cavity within the first opening, and forming a second interconnect over the first and second insulating layers. The cavity can be disposed between the first interconnect and the second interconnect. In another aspect, an electronic device can include a first interconnect, a first insulating layer defining a cavity, and a second interconnect. The cavity can be disposed between the first interconnect and the second interconnect, and a via may not be exposed within the cavity.
1. An electronic device comprising:
a substrate having a primary surface;
a first interconnect at a first elevation above the primary surface;
a plurality of insulating layers over the first interconnect to define a plurality of sealed cavities extending through the plurality of insulating layers toward the first interconnect and spaced apart from each other horizontally, the plurality of sealed cavities spaced vertically apart from the first interconnect and having sidewalls defined by the plurality of insulating layers;
an upper insulating layer disposed over the plurality of insulating layers to seal the plurality of cavities; and
a second interconnect at a second elevation above the primary surface, the first interconnect, and the plurality of insulating layers, a portion of the second interconnect overlying a portion of the first interconnect at an overlap region, the second interconnect not exposed to the plurality of sealed cavities;
wherein along a direction substantially perpendicular to the primary surface, the plurality of sealed cavities is disposed between the first interconnect and the second interconnect at the overlap region and a via located below and electrically connected to the first interconnect and is not exposed within the plurality of sealed cavities.
2. The electronic device of claim 1 , further comprising a third interconnect disposed horizontally adjacent the plurality of sealed cavities within an insulating layer of the plurality of insulating layers.
3. The electronic device of claim 1 , wherein the plurality of sealed cavities includes channels.
4. The electronic device of claim 1 , wherein the plurality of sealed cavities includes an array of sealed cavities arranged in rows and columns.
5. The electronic device of claim 1 , wherein a depth of a cavity of the plurality of sealed cavities is at least 1 micron and not greater than 9 microns.
6. The electronic device of claim 5 , wherein the depth is at least 2 microns and not greater than 5 microns.
7. The electronic device of claim 1 , wherein the width of a cavity of the plurality of sealed cavities at least 0.1 microns and not greater than 0.9 microns.
8. The electronic device of claim 7 , wherein the width is at least 0.2 microns and not greater than 0.7 microns.
9. The electronic device of claim 1 , wherein walls of a cavity of the plurality of sealed cavities are tapered.
10. The electronic device of claim 1 , wherein an aspect ratio of the height of a cavity of the plurality of sealed cavities to the width of the cavity is at least 2 and not greater than 20.
11. The electronic device of claim 10 , wherein the aspect ratio is at least 3 and not greater than 15.
12. The electronic device of claim 1 , wherein a space between two adjacent cavities of the plurality of sealed cavities is at least 1.0 times the width of the two cavities and not greater than 2.0 times the width of the two cavities.
13. The electronic device of claim 1 , wherein, from a plan view, a pattern of the plurality of sealed cavities extends beyond edges of the first interconnect.
14. The electronic device of claim 13 , wherein, from a plan view, the pattern of the plurality of sealed cavities extends beyond edges of the second interconnect.
15. The electronic device of claim 13 , wherein, from a plan view, the pattern of the plurality of sealed cavities has an extension ratio of a width of the pattern to a thickness in the plan view of the first interconnect of at least 1.1 and not greater than 2.0.
16. The electronic device of claim 15 , wherein the extension ratio is at least 1.2 and not greater than 1.5.
17. The electronic device of claim 1 , wherein the second interconnect is a high frequency data transmission interconnect.
18. The electronic device of claim 17 , wherein the second interconnect is to transmit a carrier wave at a frequency of at least 30 GHz.
19. The electronic device of claim 18 , wherein the frequency is at least 70 GHz.
20. The electronic device of claim 17 , wherein the first interconnect is to have a substantially constant voltage.