Group III-V substrate material with particular crystallographic features and methods of making

1. A method of forming a semiconductor substrate comprising:

providing a base substrate comprising a semiconductor material; and

forming a first semiconductor layer overlying the base substrate comprising a Group 13-15 material via hydride vapor phase epitaxy (HVPE), wherein the first semiconductor layer comprises an upper surface having a N-face orientation and comprising a plurality of protrusions, wherein the protrusions have a height ratio (h/t i ) of not greater than about 0.2, wherein h represents an average height of the plurality of protrusions and t i , represents an average thickness of the first semiconductor layer.

2. The method of claim 1 , wherein the base substrate comprises gallium nitride (GaN).

3. The method of claim 1 , wherein forming the first semiconductor layer is conducted at a temperature greater than 950° C.

4. The method of claim 1 , wherein the first semiconductor layer is formed directly on the base substrate without formation of an intervening buffer layer.

5. The method of claim 1 , wherein the first semiconductor layer comprises gallium nitride (GaN).

6. The method of claim 1 , wherein the first semiconductor layer comprises a dopant including Si, Ge, Fe, Mg, Zn, or combinations thereof.

7. The method of claim 1 , wherein the average thickness of the first semiconductor layer is at least about 0.1 mm.

8. The method of claim 1 , wherein forming the first semiconductor layer is conducted at a rate of at least about 50 microns/hr.

9. The method of claim 1 , wherein forming the first semiconductor layer comprises a three-dimensional growth mode, a two-dimensional growth mode, and switching between a three-dimensional and two-dimensional growth mode during epitaxial growth.

10. The method of claim 1 , wherein each protrusion of the plurality of protrusions defines a permanent defect region, wherein the permanent defect region comprises a shift in the regular arrangement of crystalline planes, wherein the permanent defect region comprises at least one of an inclusion, a polycrystalline grain, a single crystalline grain, an inversion domain, a permanent defect, and a combination thereof.

11. The method of claim 1 , further comprising removing at least a portion of the upper surface of the first semiconductor layer, wherein removing includes removing a plurality of protrusions from the upper surface, wherein removing comprises reducing a thickness of the first semiconductor layer by not greater than about 15% of an original average thickness of the first semiconductor layer.

12. The method of claim 1 , further comprising removing a portion of a back surface of the first semiconductor layer opposite the upper surface, wherein the back surface has a Ga-face orientation, wherein removing comprises a mechanical process, wherein removing including grinding, wherein removing comprises polishing.

13. The method of claim 1 , wherein forming the first semiconductor layer is conducted to form a boule, wherein the boule comprises a semiconductor layer having an average thickness sufficient to form at least two discrete freestanding semiconductor wafers from the first semiconductor layer.

14. The method of claim 13 , wherein the boule further comprises a release layer.

15. The method of claim 1 , wherein the first semiconductor layer is a boule comprising an average thickness of at least 1 cm.

16. A method of forming a series of semiconductor substrates using a single forming process, the method comprising:

providing a base substrate comprising a semiconductor material comprising nitrogen, wherein the base substrate comprises a growth surface having a N-face orientation;

forming a boule overlying the base substrate, wherein the boule comprises:

a first semiconductor layer overlying the base substrate;

a first release layer overlying the first semiconductor layer;

a second semiconductor layer overlying the first release layer;

a second release layer overlying the second semiconductor layer; and

separating the first and second semiconductor layers to form a plurality of discrete semiconductor substrates, wherein the first release layer has a first absorption coefficient such that the first release layer absorbs greater than 50% of a first wavelength of radiation, and the second release layer has a second absorption coefficient such that the second release layer transmit substantially all of the radiation of the first wavelength.

17. The method of claim 16 , wherein the first semiconductor layer is formed directly on the growth surface of the base substrate, wherein the first semiconductor layer is formed directly on the growth surface of the base substrate without formation of an intervening buffer layer.

18. The method of claim 16 , wherein separating comprises impinging the first wavelength of radiation on the first release layer to separate the first semiconductor layer from the second semiconductor layer.

19. The method of claim 16 , wherein the first release layer comprises a first dopant material and the second release layer comprises a second dopant material that is different from the first dopant material.

20. The method of claim 16 , wherein the first semiconductor layer comprises GaN, and the second semiconductor layer comprises GaN.