Heat dissipation device for electronic ballast
View Patent ↗An electronic ballast is provided with an elongated housing; a heat sink module disposed in the housing and including a channel extending from one end to an other end; a plurality of power semiconductor modules disposed on both sides of the heat sink module respectively; an inlet assembly disposed at one end of the heat sink module proximate to a first panel at one end of the housing; an outlet assembly disposed at the other end of the heat sink module proximate to a second panel at an other end of the housing; and a fan disposed between the other end of the heat sink module and the second panel. Only a small portion of heat is dissipated by surface areas of the housing. Thus, the housing can be made compact to save space.
1. An electronic ballast comprising:
an elongated housing;
a heat sink module disposed in the housing and including a channel extending from one end to an other end;
a plurality of power semiconductor modules disposed on both sides of the heat sink module respectively;
an inlet assembly disposed at one end of the heat sink module proximate to a first panel at one end of the housing;
an outlet assembly disposed at the other end of the heat sink module proximate to a second panel at an other end of the housing;
a fan disposed between the other end of the heat sink module and the second panel;
wherein the first panel includes a plurality of first openings in close proximity to one end of the channel for communicating therewith; the second panel includes a plurality of second openings; and an other end of the channel, the fan, and the second openings are aligned for communication;
a first gasket disposed to fill a space between the first openings and one end of the heat sink module;
a second gasket disposed to fill a space between the second openings and the fan; and
a third gasket disposed to fill a space between the fan and the other end of the heat sink module.
2. An electronic ballast comprising:
an elongated housing;
a heat sink module disposed in the housing and including a channel extending from one end to an other end;
a plurality of power semiconductor modules disposed on both sides of the heat sink module respectively;
an inlet assembly disposed at one end of the heat sink module proximate to a first panel at one end of the housing;
an outlet assembly disposed at the other end of the heat sink module proximate to a second panel at an other end of the housing;
a fan disposed between the other end of the heat sink module and the second panel;
a printed circuit board (PCB) disposed under the heat sink module;
wherein the first panel includes a plurality of first openings in close proximity to one end of the channel for communicating therewith; the second panel includes a plurality of second openings; and an other end of the channel, the fan, and the second openings are aligned for communication;
a first gasket disposed to fill a space between the first openings and one end of the heat sink module;
a second gasket disposed to fill a space between the second openings and the fan; and
a third gasket disposed to fill a space between the fan and the other end of the heat sink module.