Method of manufacturing semiconductor device
A method of manufacturing a semiconductor is provided. The method includes forming a thin film including a predetermined element and a borazine ring skeleton is formed on a substrate by performing a cycle a predetermined number of times. The cycle includes supplying a source gas including the predetermined element and a halogen group to the substrate and supplying a reaction gas including a borazine compound to the substrate under a condition where the borazine ring skeleton in the borazine compound is maintained.
1. A method of manufacturing a semiconductor device, the method comprising forming a thin film including a predetermined element and a borazine ring skeleton on a substrate by performing a cycle a first predetermined number of times, the cycle comprising:
supplying a source gas including the predetermined element and a halogen group to the substrate; and
supplying a reaction gas including a borazine compound to the substrate,
wherein the cycle is performed under a condition where the borazine ring skeleton in the borazine compound is maintained.
2. The method according to claim 1 , wherein in the act of supplying the source gas, a first layer including the predetermined element and the halogen group is formed, and
wherein in the act of supplying the reaction gas, a second layer including the predetermined element and the borazine ring skeleton is formed by causing the first layer to react with the borazine compound to modify the first layer.
3. The method according to claim 2 , wherein in the act of supplying the reaction gas, the halogen group included in the first layer is caused to react with a ligand included in the borazine compound.
4. The method according to claim 2 , wherein in the act of supplying the reaction gas, the halogen group included in the first layer is caused to react with a ligand included in the borazine compound to separate the halogen group reacted with the ligand from the first layer and separate the ligand reacted with the halogen group from the borazine compound.
5. The method according to claim 1 , wherein in the act of forming the thin film, the act of supplying the source gas and the act of supplying the reaction gas are alternately performed the first predetermined number of times.
6. The method according to claim 1 , wherein in the act of forming the thin film, the act of supplying the source gas and the act of supplying the reaction gas are simultaneously performed.
7. The method according to claim 1 , wherein the cycle further comprises supplying a gas including nitrogen, a gas including carbon, or a gas including nitrogen and carbon to the substrate.
8. The method according to claim 1 , wherein the cycle further comprises supplying a nitridation gas to the substrate.
9. The method according to claim 8 , wherein the cycle comprises:
alternately performing a second predetermined number of times the act of supplying the source gas and the act of supplying the reaction gas; and
performing the act of supplying the nitridation gas.
10. The method according to claim 8 , wherein in the act of supplying the nitridation gas, the nitridation gas which is activated by heat is supplied to the substrate.
11. The method according to claim 8 , wherein in the act of supplying the nitridation gas, the nitridation gas which is activated by plasma is supplied to the substrate.