Dual row quad flat no-lead semiconductor package
Some of the embodiments of the present disclosure provide a Quad Flat No-Lead package comprising: an outer row of outer peripheral leads disposed on an outer periphery of a bottom surface of the Quad Flat No-Lead package; and an inner row of inner peripheral leads disposed on an inner periphery of the bottom surface of the Quad Flat No-Lead package, wherein each of the inner peripheral leads has a substantially rectangular shape, and wherein the substantially rectangular shape has two rounded corners adjacent to the outer row of outer peripheral leads.
1. A Quad Flat No-Lead package comprising:
an outer row of outer peripheral leads disposed on an outer periphery of a bottom surface of the Quad Flat No-Lead package; and
an inner row of inner peripheral leads disposed on an inner periphery of the bottom surface of the Quad Flat No-Lead package,
wherein each of the inner peripheral leads has a substantially rectangular shape having four corners,
wherein two of the four corners that are nearest the outer row of outer peripheral leads have a rounded shape corresponding to a predetermined radius of curvature,
wherein each of the inner peripheral leads has a width in a direction parallel to a nearest edge of the bottom surface of the Quad Flat No-Lead package, and
wherein the two rounded corners of the substantially rectangular shape are rounded with the predetermined radius of curvature equal to about half the width of each of the inner peripheral leads.
2. The Quad Flat No-Lead package of claim 1 , wherein:
a distance between two adjacent outer peripheral leads of the outer peripheral leads is about equal to the width of the inner peripheral leads.
3. The Quad Flat No-Lead package of claim 1 , further comprising:
a die paddle located inside the inner periphery on the bottom surface of the Quad Flat No-Lead package; and
a plurality of conductive contacts between the die paddle and the inner periphery of the bottom surface of the Quad Flat No-Lead package, wherein the conductive contacts are electrically connected to conductors on a top surface of the Quad Flat No-Lead package by vias.
4. The Quad Flat No-Lead package of claim 3 , wherein the plurality of conductive contacts comprises a plurality of conductive pads.
5. The Quad Flat No-Lead package of claim 3 , wherein the plurality of conductive contacts comprises a plurality of conductive strips.
6. The Quad Flat No-Lead package of claim 1 , further comprising:
a top surface including (i) outer pads individually corresponding to the outer peripheral leads of the Quad Flat No-Lead package and (ii) inner pads individually corresponding to the inner peripheral leads of the Quad Flat No-Lead package, wherein
the outer pads include corner pads that are adjacent to corners of the Quad Flat No-Lead package,
the outer pads are electrically connected to the outer peripheral leads by outer vias,
the inner pads are electrically connected to the inner peripheral leads by inner vias, and
the corner pads that are adjacent to the corners of the Quad Flat No-Lead package are electrically interconnected with one another.
7. The Quad Flat No-Lead package of claim 6 , wherein all the corner pads are electrically connected to a power source or to a ground.
8. The Quad Flat No-Lead package of claim 6 , further comprising:
a die paddle located inside the inner periphery of the bottom surface of the Quad Flat No-Lead package, wherein all the corner pads are electrically connected to the die paddle.
9. A Quad Flat No-Lead package comprising:
an outer row of outer peripheral leads disposed on an outer periphery of a bottom surface of the Quad Flat No-Lead package; and
an inner row of inner peripheral leads disposed on an inner periphery of the bottom surface of the Quad Flat No-Lead package,
wherein each of the inner peripheral leads has a substantially rectangular shape having four corners,
wherein two of the four corners that are nearest the outer row of outer peripheral leads have a rounded shape corresponding to a predetermined radius of curvature, and
wherein individual outer peripheral leads of the outer peripheral leads are about equidistant from two nearest inner peripheral leads of the inner peripheral leads.
10. The Quad Flat No-Lead package of claim 9 , wherein:
a separation distance between the individual outer peripheral leads and the two nearest inner peripheral leads is about 0.3 millimeters.
11. An integrated circuit package comprising:
a Dual Row Quad Flat No-Lead package having a top surface and a bottom surface, wherein the bottom surface of the Dual Row Quad Flat No-Lead package includes (i) an outer row of outer peripheral leads disposed on an outer periphery of the bottom surface of the Dual Row Quad Flat No-Lead package and (ii) an inner row of inner peripheral leads disposed on an inner periphery of the bottom surface of the Quad Flat No-Lead package, wherein each of the inner peripheral leads has a substantially rectangular shape, wherein the substantially rectangular shape includes four corners, and wherein two of the four corners nearest the outer row of outer peripheral leads has a rounded shape corresponding to a predetermined radius of curvature; and
a printed circuit board electrically connected to the bottom surface of the Dual Row Quad Flat No-Lead package,
wherein each of the inner peripheral leads has a width in a direction parallel to a nearest edge of the bottom surface of the Dual Row Quad Flat No-Lead package, and
wherein the two rounded corners of the substantially rectangular shape are rounded with the predetermined radius of curvature equal to about half the width of each of the inner peripheral leads.
12. The integrated circuit package of claim 11 , wherein
the printed circuit board includes (i) outer land pads individually corresponding to the outer peripheral leads of the Dual Row Quad Flat No-Lead package and (ii) inner land pads individually corresponding to the inner peripheral leads of the Dual Row Quad Flat No-Lead package,
the outer land pads are electrically connected to the outer peripheral leads and the inner land pads are electrically connected to the inner peripheral leads, and
one or more conductive traces on the printed circuit board follow a path between two adjacent inner land pads.
13. The integrated circuit package of claim 12 , wherein the one or more conductive traces on the printed circuit board follow a path between an outer land pad and an adjacent inner land pad.
14. The integrated circuit package of claim 11 , further comprising:
a die paddle located inside the inner periphery of the bottom surface of the Quad Flat No-Lead package; and
a plurality of conductive contacts between the die paddle and the inner periphery of the bottom surface of the Quad Flat No-Lead package, wherein the conductive contacts are electrically connected to conductors on a top surface of the Quad Flat No-Lead package by vias.
15. The integrated circuit package of claim 14 , wherein the plurality of conductive contacts comprises a plurality of conductive pads.
16. The integrated circuit package of claim 14 , wherein the plurality of conductive contacts comprises a plurality of conductive strips.
17. The integrated circuit package of claim 11 , further comprising:
a top surface including (i) outer pads individually corresponding to the outer peripheral leads of the Quad Flat No-Lead package and (ii) inner pads individually corresponding to the inner peripheral leads of the Quad Flat No-Lead package, wherein
the outer pads include corner pads that are adjacent to corners of the Quad Flat No-Lead package,
the outer pads are electrically connected to the outer peripheral leads by outer vias,
the inner pads are electrically connected to the inner peripheral leads by inner vias, and
the corner pads that are adjacent to the corners of the Quad Flat No-Lead package are electrically interconnected with one another.
18. The integrated circuit package of claim 17 , wherein all the corner pads are electrically connected to a power source or a ground.