IP Library Granted Patent US 9,387,505
Granted Patent B2
US 9,387,505 · App. 14/024,649 · Granted Jul 12, 2016

Methods, materials and apparatus for improving control and efficiency of layer-by-layer processes

Inventors: Kevin Krogman (Santa Clara, CA); J. Wallace Parce (Palo Alto, CA); Melissa Fardy (San Jose, CA); Siglinde Schmid (Belmont, CA); Thomas Workman (San Jose, CA); Thomas Fong (San Francisco, CA); William E. Jarvis (Millbrae, CA); Benjamin Wang (Mountain View, CA)
Assignee: Eastman Chemical Company
B05D1/02B05D1/36B05D7/56B05D1/32B05D2252/02
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Quick Facts
Patent No.
US 9,387,505
App. No.
14/024,649
Granted
Jul 12, 2016
Kind
B2
Abstract

The disclosure provides materials, apparatuses, and methods for making multilayer coatings with a high degree of efficiency and control. In some aspects, for example, coatings are described having multiple layers of nanoparticles and a polyelectrolyte, wherein the nanoparticles form tightly packed monolayers. The interface between monolayers may include polyelectrolyte material. One or more aspects of such monolayers and interfaces are controllable.

Claims (37)

1. A method for depositing a film on a substrate, the method comprising:

(a) depositing a first deposition solution comprising a first deposition material on a substrate to form a first monolayer of said first deposition material;

(b) applying a rinse solution to the first monolayer for a period of time t rinse to form a rinse layer to remove excess first deposition material, wherein t rinse ≦10 seconds;

(c) reducing the thickness of said rinse layer to form a residual rinse layer having a thickness of between 0 microns and 5 microns; and

(c) either:

i) depositing a second deposition solution comprising a second deposition material on said residual rinse layer for a period of time t dep to form a second monolayer of said second deposition material, where said residual rinse layer has a non-zero thickness; or

ii) depositing said second deposition solution comprising said second deposition material on said first monolayer for a period of time t dep to form said second monolayer of said second deposition material, where said residual rinse layer is absent;

wherein t dep ≦−10 seconds;

wherein said first monolayer and said second monolayer form a bilayer.

2. The method of claim 1 , comprising repeating steps (a), (b), (c), and (d) to form a layer by layer assembled film comprising a plurality of bilayers.

3. The method of claim 1 , wherein the residual rinse solution is less than 5 microns but greater than 500 nm in thickness.

4. The method of claim 1 , wherein the first deposition solution and the second deposition solution are applied via a spray process.

5. The method of claim 1 , wherein the formed half bilayer exhibits less than 3% variation in thickness over an area of at least 16 square inches.

6. The method of claim 1 , wherein steps (b) and (c) are repeated z times to further remove unbound deposition material, wherein:

each repeat allows unbound first deposition material to diffuse away from the coating layer; and

each repeat is independently carried out for a period of time t rinse _ x , where z is an integer index.

7. The method of claim 1 , wherein t dep +t rinse <10 seconds.

8. The method of claim 1 , wherein reducing the thickness of said rinse layer comprises application of an air knife, squeegee, nip roller, heat, vacuum, translational movement, ultrasonic energy, magnetic field, electric field, or a combination thereof to said rinse layer.

9. The method of claim 1 , wherein reducing the thickness of the rinse layer is enhanced by addition of one or more additives to the rinse solution.

10. The method of claim 1 , wherein:

the formed bilayer exhibits less than 3% variation in thickness over an area of at least 16 square inches.

11. The method of claim 1 , wherein:

the second deposition solution is deposited via a spray process.

12. The method of claim 1 , wherein:

depositing a second solution comprises depositing said second solution with a thickness (d dep ), wherein d dep is given by:

C s /( C B ·eff)≧ d dep ≧( C s /C B )

and wherein t dep is given by:

t dep >C s 2 /( C B 2 ·D )

wherein:

C s is a desired 2-dimensional concentration per unit area of said second deposition material in said second monolayer;

C B is the bulk concentration per unit volume of said second deposition material in the second deposition solution;

d dep is the thickness of the layer of deposition solution on the surface;

eff is the transfer efficiency of deposition material and is greater than 0.03; and

D is the diffusion coefficient of the second deposition material in the second deposition solution.

13. The method of claim 1 , wherein the first deposition material comprises a polyelectrolyte and the second deposition material comprises nanoparticles.

14. The method of claim 1 , wherein reducing the thickness of said rinse layer comprises removing the rinse layer.

15. The method of claim 12 , wherein C s is the surface concentration based on randomly packed spheres where the areal coverage is between 0.45 and 0.54.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 7, 2015
From: SVAYA NANOTECHNOLOGIES, INC.
To: EASTMAN CHEMICAL COMPANY
Reel/Frame 035345/0261 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 12, 2013
From: KROGMAN, KEVIN; PARCE, J. WALLACE; FARDY, MELISSA; SCHMID, SIGLINDE; WORKMAN, THOMAS; FONG, THOMAS; JARVIS, WILLIAM E.; WANG, BENJAMIN
To: SVAYA NANOTECHNOLOGIES, INC.
Reel/Frame 031187/0866 →
Continuity (2)
Provisional Application 61702112 · Sep 17, 2012
Related Publication 20140079884A1 · Mar 20, 2014