Nonvolatile semiconductor storage device and method of manufacturing the same
A nonvolatile semiconductor storage device including a memory cell region including a memory cell having a charge storing layer above a gate insulating film and a control electrode above the charge storing layer via an interelectrode insulating film; and a peripheral circuit region including a peripheral element having a first polysilicon and a first insulating film above the first polysilicon; wherein the charge storing layer includes a polysilicon doped with P-type impurity including a first upper region contacting the interelectrode insulating film and having a first doped layer doped with carbon or nitrogen, and at least a portion of a region below the first doped layer is neither doped with carbon nor nitrogen, and wherein the first polysilicon includes a second upper region contacting the first insulating film and having a second doped layer doped with carbon or nitrogen, the first and the second doped layers having equal thickness.
1. A nonvolatile semiconductor storage device comprising:
a memory cell region including a memory cell having a charge storing layer above a gate insulating film and a control electrode stacked above the charge storing layer via an interelectrode insulating film; and
a peripheral circuit region including a peripheral element having a first polysilicon and a first insulating film stacked above the first polysilicon;
wherein the charge storing layer includes a polysilicon doped with P-type impurity, the polysilicon doped with the P-type impurity including a first upper region contacting the interelectrode insulating film, the first upper region having a first doped layer doped with carbon (C) or nitrogen (N), and at least a portion of a region below the first doped layer is neither doped with carbon (C) nor nitrogen (N), and
wherein the first polysilicon includes a second upper region contacting the first insulating film, the second upper region having a second doped layer doped with carbon (C) or nitrogen (N), the second doped layer having a thickness equal to a thickness of the first doped layer.
2. The device according to claim 1 being applied to a NAND flash memory device.
3. The device according to claim 1 , wherein the polysilicon doped with P-type impurity further includes, in a lowermost portion thereof contacting the gate insulating film, a third doped layer doped with carbon (C) or nitrogen (N).
4. The device according to claim 1 , wherein the peripheral circuit region further includes a resistive element including a second polysilicon and a second insulating film stacked above the second polysilicon, and wherein the second polysilicon includes a third upper region contacting the second insulating film, the third upper region having a third doped layer doped with carbon (C) or nitrogen (N), the third doped layer having a thickness equal to the thickness of the first doped layer.
5. The device according to claim 1 , wherein the thickness of the first doped layer and the thickness of the second doped layer each indicate a distance to a detection limit in which concentration of carbon (C) or nitrogen (N) can be detected, the distance being taken along a stacking direction.
6. The device according to claim 4 , wherein the thickness of the first doped layer and the thickness of the third doped layer each indicate a distance to a detection limit in which concentration of carbon (C) or nitrogen (N) can be detected, the distance being taken along a stacking direction.