IP Library Granted Patent US 9,406,809
Granted Patent B2
US 9,406,809 · App. 14/024,881 · Granted Aug 2, 2016

Field-effect transistor

Inventors: Kenichi Umeda (Ashigarakami-gun, JP); Takamichi Fujii (Ashigarakami-gun, JP)
Assignee: FUJIFILM Corporation
H01L29/7869H01L29/78603H01L2924/0002
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Quick Facts
Patent No.
US 9,406,809
App. No.
14/024,881
Granted
Aug 2, 2016
Kind
B2
Abstract

There is provided a field effect transistor having, on a substrate, at least a gate electrode, a gate insulating film, an active layer mainly containing an oxide semiconductor that contains at least one of In, Ga or Zn, a source electrode, and a drain electrode, the field effect transistor including: a heat diffusion layer, wherein, given that a thermal conductivity of the substrate is N sub (W/mK), a thermal conductivity of the heat diffusion layer is N kaku (W/mK), a film thickness of the heat diffusion layer is T (mm), a planar opening ratio of the heat diffusion layer is R (0≦R≦1), and S=T×R, the thermal conductivity N sub of the substrate satisfies the condition N sub <1.8, and the thermal conductivity N kaku of the heat diffusion layer satisfies the conditions N kaku >3.0×S^(−0.97×e^(−1.2×N sub )) and N kaku ≧N sub .

Claims (20)

1. A field effect transistor having, on a resin substrate, at least a gate electrode, a gate insulating film, an active layer mainly containing an oxide semiconductor that contains at least one of In, Ga or Zn, a source electrode, and a drain electrode, the field effect transistor comprising:

a heat diffusion layer that is the same as or separate from the gate insulating film, and that is different than the gate electrode, the source electrode and the drain electrode,

wherein, given that a thermal conductivity of the resin substrate is N sub (W/mK), a thermal conductivity of the heat diffusion layer is N kaku (W/mK), a film thickness of the heat diffusion layer is T (mm), an opening ratio of the heat diffusion layer is R (0≦R≦1), and S=T×R,

the thermal conductivity N sub of the resin substrate satisfies the condition N sub <1.8, and

the thermal conductivity N kaku of the heat diffusion layer satisfies the conditions N kaku >3.0×S^(−0.97×e^(−1.2×N sub )) and N kaku ≧N sub .

2. The field effect transistor of claim 1 , wherein at least one layer or more of a thin film of less than or equal to 1 μm exists between the active layer and the heat diffusion layer.

3. The field effect transistor of claim 2 , wherein the heat diffusion layer is a nitride film containing at least one of Al or Ga.

4. The field effect transistor of claim 3 , wherein the transmittivity of the heat diffusion layer is greater than or equal to 70% with respect to light of a wavelength range of greater than or equal to 400 nm and less than or equal to 700 nm.

5. A display device comprising the field effect transistor of claim 1 .

6. A sensor comprising the field effect transistor of claim 1 .

7. A field effect transistor having, on a resin substrate, at least a gate electrode, a gate insulating film, an active layer mainly containing an oxide semiconductor that contains at least one of In, Ga or Zn, a source electrode, and a drain electrode, the field effect transistor comprising:

a heat diffusion layer that is the same as or separate from the gate insulating film, and that is different than the gate electrode, the source electrode and the drain electrode,

wherein, given that a thermal conductivity of the resin substrate is N sub (W/mK), a thermal conductivity of the heat diffusion layer is N kaku (W/mK), a film thickness of the heat diffusion layer is T (mm), an opening ratio of the heat diffusion layer is R (0≦R≦1), and S=T×R,

the thermal conductivity N sub of the resin substrate satisfies the condition N sub <0.5, and

the thermal conductivity N kaku of the heat diffusion layer satisfies the conditions N kaku >0.4×S^(−1.2×e^(−3.5×N sub )) and N kaku ≧N sub .

8. The field effect transistor of claim 7 , wherein at least one layer or more of a thin film of less than or equal to 1 μm exists between the active layer and the heat diffusion layer.

9. The field effect transistor of claim 8 , wherein the heat diffusion layer is a nitride film containing at least one of Al or Ga.

10. The field effect transistor of claim 9 , wherein the transmittivity of the heat diffusion layer is greater than or equal to 70% with respect to light of a wavelength range of greater than or equal to 400 nm and less than or equal to 700 nm.

11. A display device comprising the field effect transistor of claim 7 .

12. A sensor comprising the field effect transistor of claim 7 .

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 20, 2022
From: FUJIFILM CORPORATION
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 061486/0104 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 12, 2013
From: UMEDA, KENICHI; FUJII, TAKAMICHI
To: FUJIFILM CORPORATION
Reel/Frame 031195/0036 →
Priority Claims (1)
JP 2011-060872 · Mar 18, 2011 · national
Continuity (2)
Continuation PCTJP2012053013 · Feb 9, 2012
Related Publication 20140008649A1 · Jan 9, 2014