Probe apparatus and test apparatus

1. A probe apparatus that provides an electrical connection between a device under test and a test apparatus body, comprising:

a device-side terminal unit that includes a flexible sheet and a plurality of device-side connection terminals passing through the sheet and connected to the device under test;

an intermediate substrate that is provided on the test apparatus body side of the device-side terminal unit and includes a plurality of device-side intermediate electrodes electrically connected to the device-side connection terminals and a plurality of tester-side intermediate electrodes electrically connected to the test apparatus body, the tester-side intermediate electrodes of the intermediate substrate provided at intervals greater than intervals at which the device-side intermediate electrodes are provided, the intermediate substrate including:

a substrate body including ceramic, and

a plurality of connection modules that are mounted on a top surface of the substrate body on the test apparatus body side in a grid arrangement, the plurality of connection modules including a plurality of substrate-side terminals on the substrate body side thereof and the tester-side intermediate electrodes on a side thereof opposite the substrate body, the plurality of connection modules including a resistor connected to a wire between at least one substrate-side terminal and a corresponding tester-side intermediate electrode;

an anisotropic conductive film that is arranged between the device-side terminal unit and the intermediate substrate and provides a connection between the device-side connection terminals and the device-side intermediate electrodes;

a tester-side substrate that is provided on the test apparatus body side of the intermediate substrate and includes, on the intermediate substrate side thereof, a plurality of tester-side electrodes electrically connected to the test apparatus body; and

a contact section that is provided between the intermediate substrate and the tester-side substrate and includes a plurality of contact blocks, each contact block connected to a corresponding connection module of the plurality of connection modules, each contact block including

a plurality of first pins connected to the tester-side intermediate electrodes,

a plurality of second pins connected to the tester-side electrodes, each first pin of the plurality of first pins corresponds with a corresponding second pin of the plurality of second pins, and

a plurality of through-electrodes, each through electrode connecting a first pin of the plurality of first pins to the corresponding second pin of the plurality of second pins, and each through-electrode including a spring.

2. A test apparatus that tests a plurality of devices under test formed on a semiconductor wafer, comprising:

a testing section that tests the plurality of devices under test by exchanging electrical signals with the devices under test; and

the probe apparatus of claim 1 that electrically connects the testing section to electrodes of each of the devices under test.