Surface treatment to improve CCTBA based CVD co nucleation on dielectric substrate
Embodiments of the present invention generally relate to a method of forming a cobalt layer on a dielectric material without incubation delay. Prior to depositing the cobalt layer using CVD, the surface of the dielectric material is pretreated at a temperature between 100° C. and 250° C. Since the subsequent CVD cobalt process is also performed at between 100° C. and 250° C., one processing chamber is used for pretreating the dielectric material and forming of the cobalt layer. The combination of processing steps enables use of two processing chambers to deposit cobalt.
1. A method for forming a metal interconnect, comprising:
placing a substrate into a processing chamber;
pretreating a surface of the substrate at a temperature between 125° C. and 175° C., wherein the pretreating the surface of the substrate comprises exposing the surface to a titanium containing precursor gas to form a monolayer of the titanium containing precursor gas molecules on the surface; and
depositing a cobalt layer in direct contact with the surface, wherein the cobalt layer is deposited using dicobalt hexacarbonyl tertbutyl acetylene and no titanium nitride is formed between the cobalt layer and the surface.
2. The method of claim 1 , wherein the cobalt layer is deposited by a chemical vapor deposition process.
3. The method of claim 2 , wherein the chemical vapor deposition is performed at a temperature between 100° C. and 250° C.
4. The method of claim 3 , wherein the surface of the substrate comprises silicon dioxide or a low-k dielectric.
5. The method of claim 1 , wherein the titanium containing precursor gas comprises tetrakis(dimethylamino)titanium or titanium tetrachloride.