Continuous substrate treatment plant and cleaning method
A substrate treatment plant includes a process chamber delimited by chamber walls and in the process chamber a substrate conveying unit for the horizontal conveyance of slab-shaped substrates in one conveying plane and in one conveying direction. The substrate conveying unit includes an arrangement of rotatably mounted, cylindrical conveying rollers transversely arranged to the conveying direction, the topmost generatrices of the conveying rollers defining the conveying plane, and at least one substrate treatment unit, which is located above the conveying plane, and at least one gas inlet. In the region of the substrate treatment unit at least one additional heating unit is located below the conveying plane and a condensation unit is located under the substrate conveying unit.
1. A substrate treatment plant, comprising a process chamber delimited by chamber walls and having in the process chamber:
a substrate conveying unit for horizontal conveyance of slab-shaped substrates in a conveying plane and in a conveying direction, wherein the substrate conveying unit comprises an arrangement of rotatably mounted, cylindrical conveying rollers transversely arranged to the conveying direction, topmost generatrices of said conveying rollers defining the conveying plane, bottommost generatrices of said conveying rollers defining a lower plane,
at least one substrate treatment unit located above the conveying plane, at least one gas inlet, and
a cleaning device for removing an undesirable coaling from a conveying roller of the substrate conveying unit while the conveying roller supports a substrate, the cleaning device being located in a region of the at least one substrate treatment unit, and including at least one ancillary heating unit located adjacent the conveying roller, below the conveying plane, and operative to remove the undesirable coating from the conveying roller while the conveying roller is supporting a substrate, and a discharge duct of a condensation unit located under the substrate conveying; unit,
wherein the condensation unit further comprises a condenser, and a pump unit, both located outside of the process chamber,
wherein the undesirable coating on the conveying roller of the substrate conveying unit is, in a targeted manner, evaporated or sublimed or melted by the at least one ancillary heating unit, discharged from the process chamber through the discharge duct, and condensed outside of the processing chamber in the condenser,
wherein an ancillary heating unit of the at least one ancillary heating unit is located between at least one pair of adjacent conveying rollers, and between the conveying plane and the lower plane, such that a base surface, which extends parallel to the conveying plane, of the ancillary heating unit, measured in the conveying direction, has an extent which is larger than a clear distance between the at least one pair of adjacent conveying rollers, and
wherein the base surface of the ancillary heating unit is formed by at least one panel extending laterally from a protective pipe of circular cross-section of the ancillary heating unit.
2. The substrate treatment plant as claimed in claim 1 , wherein the at least one ancillary heating unit is located opposite the substrate treatment unit below the conveying plane on a side of the conveying rollers which faces away from the conveying plane, and within the discharge duct.
3. The substrate treatment plant as claimed in claim 1 , wherein a heat protective insulation is configured parallel to at least one chamber wall, wherein electrical connections of the at least one ancillary heating unit are located between the heat protective insulation and the chamber wall.
4. The substrate treatment plant as claimed in claim 1 , wherein the at least one gas inlet comprises a gas inlet in front of the substrate treatment unit and a gas inlet behind the substrate treatment unit for introducing and configuring a gas flow of a carrier gas past the conveying roller such that a gas mixture of carrier gas and material of the undesirable coating is conveyed into the discharge duct,
wherein the gas mixture of a carrier gas and material of the undesirable coating is condensed in the condenser, and condensate is pumped off by the pump unit.