Method of making molded LED package

1. A method of packaging a light emitting diode (LED), comprising:

providing a lead frame comprising a first lead having a first recess in a bottom surface and a second lead having a second recess in a bottom surface;

placing a LED die over a top surface of at least one of the first and the second leads;

electrically connecting the LED die to the first lead and to the second lead;

forming a package around the LED die, the first lead and the second lead, the package having an opening in its upper surface exposing at least the LED die; and

separating the package containing the LED die, the first lead and the second lead from the lead frame such that the package contains a first castellation and a second castellation in a side surface of the package, wherein the step of separating the package from the lead frame comprises dicing or snapping the package from the lead frame to expose the first castellation and the second castellation in the side surface of the package;

wherein:

the first castellation exposes at least one of the first lead and a first platable metal which is electrically connected to the first lead; and

the second castellation exposes at least one of the second lead and a second platable metal which is electrically connected to the second lead, wherein the method further comprising forming the first platable metal in the first recess on the first lead and forming the second platable metal in the second recess on the second lead, wherein the first castellation exposes an edge of the first lead and the first platable metal, and the second castellation exposes an edge of the second lead and the second platable metal.

2. The method of claim 1 , wherein:

the step of forming the package comprises dipping the lead frame into a mold containing an epoxy and solidifying the epoxy to form the package attached to the lead frame; and

the step of electrically connecting the LED die to the first lead and to the second lead comprises wire bonding the LED die to the first lead and to the second lead before or after the step of forming the package.

3. The method of claim 1 , further comprising attaching a bottom surface of the package to dicing tape prior to the step of separating the package from the lead frame.

4. The method of claim 3 , wherein the step of separating the package from the lead frame comprises dicing the package from the lead frame along a dicing line which passes through the first recess and the second recess to expose the first castellation and the second castellation in the side surface of the package.

5. The method of claim 1 , further comprising: after the step of separating the package, placing the package on a support surface in a side emitting configuration such that the side surface of the package faces the support surface.

6. The method of claim 5 , wherein:

the support surface comprises a first electrical contact and a second electrical contact;

the first electrical contact electrically contacts the first lead through the first castellation;

the second electrical contact electrically contacts the second lead through the second castellation;

the opening in an upper surface of the package is located in a plane perpendicular to the support surface; and

a light emitting surface of the LED die is positioned in the package to emit light parallel to the support surface.

7. The method of claim 1 , further comprising: after the step of separating the package, placing the package on a support surface in a top emitting configuration such that the first and the second leads exposed in the bottom surface of the package contact respective first and second electrical contacts located over the support surface.

8. The method of claim 1 , wherein the LED die comprises at least one green emitting LED die.

9. The method of claim 1 , wherein placing the LED die over the top surface of at least one of the first and the second leads comprising bonding the LED die to the top surface of at least one of the first and the second leads.

10. The method of claim 1 , further comprising etching the lead frame to etch sides and ends of at least the first and the second leads to increase a surface area of the first and the second leads.