IP Library › Granted Patent US 9,101,932
Granted Patent B2
US 9,101,932 · App. 14/031,941 · Granted Aug 11, 2015

Fluid handling apparatus

Inventor: Koichi Ono (Saitama, JP)
Assignee: ENPLAS Corporation
B01L3/502715G01N27/44791B01L2200/027B01L2200/10B01L2300/0645B01L2300/0816B01L2300/0867B01L2300/0887B01L2300/1827B01L2400/0415B01L2400/0421
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Quick Facts
Patent No.
US 9,101,932
App. No.
14/031,941
Granted
Aug 11, 2015
Kind
B2
Abstract

Microchannel chip ( 100 ) has film ( 120 ) adhered on the second surface of base ( 110 ) having a through-hole ( 111 ), and conductive layer ( 130 ). Film ( 120 ) has hole ( 121 ) and covers a second opening of the through-hole ( 111 ). Conductive layer ( 130 ) is integrally formed so as to extend from a portion of a bottom of hole ( 121 ) of base ( 110 ) to a portion of an inner surface of through-hole ( 111 ). Upon comparison with a microchannel chip in the related art, microchannel chip ( 100 ) is further reduced in size, has excellent handleability and is easy to be manufactured.

Claims (5)

1. A fluid handling apparatus comprising:

a base which has a first surface, a second surface opposing to the first surface, and a through-hole penetrating the base and having a first opening formed on the first surface and a second opening formed on the second surface;

a film adhered to the second surface to cover the second opening, the film having a through-hole at a position apart from the second opening in a planar direction of the base; and

a transfer function layer for transferring heat or electrical conduction, the transfer function layer disposed in the through hole of the film and extending into the through-hole of the base.

2. The fluid handling apparatus according to claim 1 , wherein the base further includes an inclined surface which is inclined from the second surface to an inner surface of the through-hole of the base, such that a distance between the film and the inclined surface in a thickness direction of the base gradually increases as the inclined surface approaches to the through-hole of the base from the through-hole of the film side in the planar direction of the base.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2013
From: ONO, KOICHI
To: ENPLAS CORPORATION
Reel/Frame 031687/0452 →
Priority Claims (1)
JP 2012-206554 · Sep 20, 2012 · national
Continuity (1)
Related Publication 20140079602A1 · Mar 20, 2014