IP Library › Granted Patent US 9,261,930
Granted Patent B2
US 9,261,930 · App. 14/032,273 · Granted Feb 16, 2016

Electronics enclosure with redundant thermal sensing architecture

Inventor: Arden L. Moore (Cedar Park, TX)
Assignee: International Business Machines Corporation
G06F1/206
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Quick Facts
Patent No.
US 9,261,930
App. No.
14/032,273
Granted
Feb 16, 2016
Kind
B2
Abstract

Embodiments include determining, based on component temperature information of a thermal sensor associated with a component, that a temperature of the component of a computer system has surpassed a temperature threshold. A thermal sensor that is downstream from the component is identified, wherein the downstream thermal sensor is downstream from the component as defined by airflow through the computer system. Downstream temperature information as measured by the downstream sensor is determined. The downstream temperature information and the component temperature information are compared.

Claims (15)

1. A method for downstream redundant thermal sensing in a computer system, the method comprising:

determining, based on a measurement from a first thermal sensor on or proximate to a component of the computer system, that a component temperature of the component has surpassed a temperature threshold, wherein a first distance between the first thermal sensor and the component comprises a first length;

in response to the component temperature surpassing the temperature threshold,

identifying a second thermal sensor that is downstream from the component, wherein the second thermal sensor is downstream from the component as defined by airflow through the computer system, wherein a second distance between the second thermal sensor and the component comprises a second length, wherein the second length is greater than the first length;

determining a downstream temperature as measured by the second thermal sensor;

determining whether the downstream temperature exceeds the temperature threshold; and

in response to the downstream temperature exceeding the temperature threshold, initiating cooling to reduce the component temperature by performing at least one of the following,

increasing a speed of a fan; and

decreasing a workload of the component.

2. The method of claim 1 , further comprising:

in response to the downstream temperature not exceeding the temperature threshold,

logging an error that indicates that the first thermal sensor is malfunctioning.

3. The method of claim 1 , wherein in response to the downstream temperature exceeding the temperature threshold, initiating logging.

4. The method of claim 1 , wherein the determining that the component temperature has surpassed the temperature threshold comprises receiving, from the first thermal sensor, the component temperature.

5. The method of claim 1 , wherein the determining that the component temperature has surpassed the temperature threshold comprises accessing memory that hosts temperature information written to the memory by the first thermal sensor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2013
From: MOORE, ARDEN L.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 031250/0320 →
Continuity (2)
Continuation 14013147 · Aug 29, 2013
Related Publication 20150066420A1 · Mar 5, 2015