IP Library Granted Patent US 8,847,193
Granted Patent B2
US 8,847,193 · App. 14/033,913 · Granted Sep 30, 2014

Phase change current density control structure

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,847,193
App. No.
14/033,913
Granted
Sep 30, 2014
Kind
B2
Abstract

A phase change memory element and method of forming the same. The memory element includes first and second electrodes. A first layer of phase change material is between the first and second electrodes. A second layer including a metal-chalcogenide material is also between the first and second electrodes and is one of a phase change material and a conductive material. An insulating layer is between the first and second layers. There is at least one opening in the insulating layer providing contact between the first and second layers.

Claims (20)

1. A processor system comprising:

a processor; and

a memory device coupled to the processor and comprising a memory element, the memory element comprising:

a first electrode,

a second electrode;

a first phase change material between the first and second electrodes,

a second metal-chalcogenide material between the first and second electrodes, and

an insulating layer between the first and second materials, at least one opening in the insulating layer providing contact between the first and second materials;

wherein the at least one opening area is smaller than the surface area of at least one of the first and second electrodes to increase current density during an operation of the memory element.

2. The system of claim 1 , wherein the first material comprises a chalcogenide material.

3. The system of claim 2 , wherein the first material comprises germanium-telluride.

4. The system of claim 1 , wherein the first material has a thickness of about 300 Å to about 500 Å.

5. The system of claim 1 , wherein the second material comprises a metal-chalcogenide material.

6. The system of claim 5 , wherein the second material comprises tin-telluride.

7. The system of claim 1 , wherein the second material has a thickness of about 500 Å to about 700 Å.

8. The system of claim 1 , wherein the at least one opening is at least partially directly above the second electrode.

9. The system of claim 1 , wherein the insulating layer comprises amorphous carbon.

10. The system of claim 1 , wherein at least one of the first and second electrodes comprise tungsten.

11. The system of claim 1 , wherein the at least one opening comprises at least two openings.

12. The system of claim 1 , wherein the current density is used to change the phase of at least a portion of one or more of the first material, the second material, or an interface between the first and second materials.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 1, 2016
From: MICRON TECHNOLOGY, INC
To: OVONYX MEMORY TECHNOLOGY, LLC
Reel/Frame 039974/0496 →