Heat dissipation structure for hand-held mobile device
A heat dissipation structure for hand-held mobile device includes a supporting body having a first and an opposite second side and including at least one heat dissipation area. In the heat dissipation area, a heat dissipation element is correspondingly fitted without increasing an overall thickness and volume of the supporting body for the hand-held mobile device. With the heat dissipation element fitted in the heat dissipation area on the supporting body, heat produced by the hand-held mobile device during operation thereof can be quickly transferred to the heat dissipation element for dissipating into ambient air.
1. A heat dissipation structure for hand-held mobile device, comprising a supporting body; the supporting body having a first side and an opposite second side, and including at least one heat dissipation area, at where a heat dissipation element is located; and
wherein the first side of the supporting body has at least one electronic element attached thereto and the second side of the supporting body is attached to at least one case member; and wherein the heat dissipation element has a heat absorption surface and an opposite heat dissipation surface; the heat absorption surface being in flat contact with at least one heat-producing unit, and the heat dissipation surface being in flat contact with the case member.
2. The heat dissipation structure for hand-held mobile device as claimed in claim 1 , wherein the heat dissipation area is an opening extended through the supporting body in a thickness direction thereof to communicate the first side with the second side; the heat dissipation element being correspondingly fitted in the opening and having a heat absorption surface and an opposite heat dissipation surface; the heat absorption surface being flush with the first side of the supporting body, and the heat dissipation surface being flush with the second side of the supporting body.
3. The heat dissipation structure for hand-held mobile device as claimed in claim 1 , wherein the heat dissipation element is selected from the group consisting of a vapor chamber and a thin heat pipe.
4. The heat dissipation structure for hand-held mobile device as claimed in claim 1 , wherein the heat dissipation element is joined to the supporting body by a means selected from the group consisting of riveting, diffusion bonding, welding and gluing.
5. The heat dissipation structure for hand-held mobile device as claimed in claim 1 , wherein the heat dissipation area is configured as a recess sunk from the first side of the supporting body; the heat dissipation element being correspondingly fitted in the recess and having a heat absorption surface and an opposite heat dissipation surface; the heat absorption surface being flush with the first side of the supporting body and in flat contact with a heat-producing unit, and the heat dissipation surface being in flat contact with a bottom of the recess on the supporting body.
6. The heat dissipation structure for hand-held mobile device as claimed in claim 1 , wherein the heat dissipation element internally defines a chamber, in which a layer of wick structure and a working fluid is provided.