Clock skew adjusting method and structure
View Patent ↗A clock transmission adjusting method applied to integrated circuit design is provided. The clock transmission adjusting method includes the following steps. At first, a timing path including a clock source and a sequential logic cell is provided. Then, at least one non-active wire delay module is inserted in the timing path to approach a predetermined clock arrival time. An integrated circuit structure utilizing the clock transmission adjusting method is also provided.
1. An adjusting method of clock transmission applied to integrated circuit design, the integrated circuit design includes a substrate and a wiring, the adjusting method comprising steps of:
providing a timing path to the substrate including at least a clock source and a sequential logic cell, the clock source and the sequential logic cell electrically connected with each other through the wiring so as to form the timing path; and
inserting at least one non-active wire delay module on the substrate in the timing path for adjusting the clock transmission time to approach a predetermined clock arrival time through the non-active wire delay module;
wherein the non-active wire delay module is implemented by a multi-layer wiring structure on the substrate of the integrated circuit;
wherein the multi-layer wiring structure comprises a plurality of wires allocated on different wiring layers;
wherein two of the plurality of wires allocated on different wiring layers are electrically connected to each other through a via or a via array.
2. The adjusting method according to claim 1 , wherein the non-active wire delay module is modified to have a three-dimensional structure.
3. An integrated circuit structure, comprising:
a semiconductor substrate having therein a clock source and a sequential logic cell;
a signal wire electrically connected between the clock source and the sequential logic cell to form a timing path; and
a clock transmission adjusting structure disposed on a surface of the semiconductor substrate and including a non-active wire delay module electrically connected between the clock source and the sequential logic cell of the timing path;
wherein the non-active wire delay module is implemented by a multi-layer wiring structure on the surface of the semiconductor substrate;
wherein the multi-layer wiring structure comprises a plurality of wires allocated on different wiring layers;
wherein two of the plurality of wires allocated on different wiring layers are electrically connected to each other through a via or a via array.
4. The integrated circuit structure according to claim 3 , wherein the semiconductor substrate is a silicon substrate and the sequential logic cell is a flip-flop.
5. The integrated circuit structure according to claim 3 , wherein the non-active wire delay module is modified to have a three-dimensional structure.
6. The integrated circuit structure according to claim 4 , wherein the plurality of wires allocated on different wiring layers are parallel.