Package assembly for thin wafer shipping and method of use

1. A package assembly comprising:

a shipping container;

a wafer container having a bottom surface and a plurality of straps attached thereto, placed within the shipping container;

upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof; and

a plurality of tabs extending from an outermost perimeter of the bottom surface and positioned between the bottom surface and the plurality of straps.

2. The package assembly of claim 1 , wherein the wafer container comprises electrostatic discharge (ESD) compliant material.

3. The package assembly of claim 1 , wherein the straps are hinged or flexible.

4. The package assembly of claim 3 , wherein each of the plurality of straps is spaced equidistance from one another about a circumference of the bottom surface.

5. The package assembly of claim 4 , wherein the straps include tabbed portions.

6. The package assembly of claim 5 , wherein straps of the plurality of straps include slits.

7. The package assembly of claim 4 , wherein the tabs include a height equal to about a height of the force distribution plates and a stack of wafers interposed with ESD compliant material sheets all positioned within the wafer container, wherein the tabs comprise an ESD compliant material.

8. The package assembly of claim 1 , wherein the upper and lower force distribution plates are positioned within the wafer container, on a top side and bottom side of a stack of wafers also within the wafer container.

9. The package assembly of claim 8 , wherein the upper and lower force distribution plates are structured:

to distribute forces over an entire surface of wafers of the stack of wafers; and

to contain the stack of wafers as a unit, allowing them to move only as a unit and distribute all forces across a wafer surface.

10. The package assembly of claim 9 , wherein the upper and lower force distribution plates are electrostatic discharge (ESD) compliant material.

11. The package assembly of claim 10 , further comprising upper and lower foam cushions or sheets positioned above and below the wafer container and one or more foam cushions or sheets positioned about a periphery of the stack of wafers.

12. The package assembly of claim 11 , further comprising a cover on the upper foam cushion or sheet.

13. A package assembly, comprising:

a wafer container comprising a bottom surface and a plurality of straps attached thereto;

a stack of wafers interposed with ESD compliant material sheets positioned within the wafer container;

a distribution plate positioned on a top side and bottom side of the stack of wafers, wherein the distribution plates are structured to:

contain the stack of wafers as a unit; and

distribute forces across a surface of the stack of wafers; and

a plurality of tabs extending from an outermost perimeter of the bottom surface and positioned between the plurality of straps and the bottom surface.

14. The package assembly of claim 13 , wherein the distribution plates are contained within the wafer container on a top side and bottom side of the stack of wafers.

15. The package assembly of claim 13 , wherein:

the wafer container comprises electrostatic discharge (ESD) compliant material;

the straps are one of a hinged and flexible material; and

each of the plurality of straps is spaced equidistance from one another about a circumference of the bottom surface.

16. The package assembly of claim 15 , wherein straps of the plurality of straps include at least one of tabbed portions and slits.

17. The package assembly of claim 15 , wherein the tabs include a height equal to about a height of the force distribution plates and the stack of wafers interposed with ESD compliant material sheets all positioned within the wafer container, wherein the tabs comprise an ESD compliant material.

18. The package assembly of claim 13 , further comprising:

a shipping container which holds the wafer container, the stack of wafers which are interposed with ESD compliant material sheets, and the distribution plates;

upper and lower foam cushions or sheets positioned above and below the wafer container;

one or more foam cushions or sheets positioned about a periphery of the stack of wafers; and

a cover on the upper foam cushion or sheet.