IP Library Granted Patent US 9,428,831
Granted Patent B2
US 9,428,831 · App. 14/041,313 · Granted Aug 30, 2016

Heat equalizer

Inventors: Hisaaki Yamakage (Tokyo, JP); Yoshihito Yamada (Tokyo, JP)
Assignee: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
C23C16/4485C23C14/243F22B1/16
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Quick Facts
Patent No.
US 9,428,831
App. No.
14/041,313
Granted
Aug 30, 2016
Kind
B2
Abstract

A heat equalizer includes a container structure, a material feed pipe, and a heating mechanism. The container structure includes an inner container and an outer container. In the outer container, a working fluid is held. Respective upper ends of the inner container and the outer container are joined to form a hollow portion between the inner container and the outer container. The material feed pipe extends from an outside of the container structure to the inner surface of the inner container. The heating mechanism is placed at the bottom of the outer container. At the bottom surface of the inner container, a plurality of protrusions protruding toward the inside of the inner container and depressions formed by the bottom surface depressed inward of the protrusions and capable of receiving the vaporized working fluid are formed.

Claims (20)

1. A heat equalizer comprising:

a container structure including a heating block with a flow path formed so that a material to be heated flows in the flow path, and an outer container in which a working fluid is held, respective upper ends of said heating block and said outer container being joined to form a hollow portion between said heating block and said outer container;

a material feed pipe allowing an outside of said container structure and said heating block to communicate with each other; and

heating means placed at a bottom of said outer container, wherein

said flow path includes a first flow path connected to said material feed pipe and extending in a horizontal direction, a second flow path branching from said first flow path and extending in a vertical direction, and an opening formed by said second flow path opening at an upper surface of said container structure,

at a bottom surface of said heating block, a plurality of depressions formed by said bottom surface depressed toward an inside of said heating block and capable of receiving a vaporized working fluid are formed,

said second flow path is placed between said depressions adjacent to each other,

a heater housing tube having one end secured to said outer container and the other end immersed in the working fluid of liquid state; and

a heater housed in said heater housing tube and having a heat generating portion, wherein

said heat generating portion is placed away from said one end of said heater housing tube that is secured to said outer container.

2. The heat equalizer according to claim 1 , wherein

said heating means is in thermal contact with an outer surface of said outer container.

3. The heat equalizer according to claim 1 , wherein

a fin body is formed at an inner surface of the bottom of said outer container.

4. The heat equalizer according to claim 1 , wherein

a boiling promoter is placed at an inner surface of the bottom of said outer container.

5. The heat equalizer according to claim 1 , wherein

a fin body is formed at an outer surface of said heater housing tube.

6. The heat equalizer according to claim 1 , wherein

a boiling promoter is placed at an outer surface of said heater housing tube.

Assignments (2)
CHANGE OF NAME Recorded Apr 26, 2024
From: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
To: TMEIC CORPORATION
Reel/Frame 067244/0359 →
CORPORATE ADDRESS CHANGE Recorded Jul 21, 2016
From: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
To: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
Reel/Frame 039421/0197 →
Continuity (2)
Division 12935480
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