IP Library Granted Patent US 9,428,832
Granted Patent B2
US 9,428,832 · App. 14/041,353 · Granted Aug 30, 2016

Heat equalizer

Inventors: Hisaaki Yamakage (Tokyo, JP); Yoshihito Yamada (Tokyo, JP)
Assignee: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
C23C16/4485C23C14/243F22B1/16
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Quick Facts
Patent No.
US 9,428,832
App. No.
14/041,353
Granted
Aug 30, 2016
Kind
B2
Abstract

A heat equalizer includes a container structure, a material feed pipe, and a heating mechanism. The container structure includes an inner container and an outer container. In the outer container, a working fluid is held. Respective upper ends of the inner container and the outer container are joined to form a hollow portion between the inner container and the outer container. The material feed pipe extends from an outside of the container structure to the inner surface of the inner container. The heating mechanism is placed at the bottom of the outer container. At the bottom surface of the inner container, a plurality of protrusions protruding toward the inside of the inner container and depressions formed by the bottom surface depressed inward of the protrusions and capable of receiving the vaporized working fluid are formed.

Claims (18)

1. A heat equalizer comprising:

a container structure including an outer container with a closed space which is formed in said outer container and in which a working fluid is held;

heating means placed at a bottom of said outer container; and

a pipe channel in which a material to be heated flows,

said pipe channel including:

a material feed pipe allowing an outside and an inside of said container structure to communicate with each other;

a main header pipe connected to said material feed pipe and extending in a horizontal direction;

branch header pipes branching from said main header pipe and extending in the horizontal direction;

a plurality of riser pipes branching from said branch header pipes and opening at an upper surface of said container structure,

a heater housing tube having one end secured to said outer container and the other end immersed in the working fluid of liquid state; and

a heater housed in said heater housing tube and having a heat generating portion, wherein

said heat generating portion is placed away from said one end of said heater housing tube that is secured to said outer container.

2. The heat equalizer according to claim 1 , wherein

said heating means is in thermal contact with an outer surface of said outer container.

3. The heat equalizer according to claim 1 , wherein a fin body is formed at an inner surface of the bottom of said outer container.

4. The heat equalizer according to claim 1 , wherein a boiling promoter is placed at an inner surface of the bottom of said outer container.

5. The heat equalizer according to claim 1 , wherein a fin body is formed at an outer surface of said heater housing tube.

6. The heat equalizer according to claim 1 , wherein a boiling promoter is placed at an outer surface of said heater housing tube.

Assignments (2)
CHANGE OF NAME Recorded Apr 26, 2024
From: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
To: TMEIC CORPORATION
Reel/Frame 067244/0359 →
CORPORATE ADDRESS CHANGE Recorded Jul 21, 2016
From: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
To: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
Reel/Frame 039421/0875 →
Continuity (2)
Division 12935480
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