IP Library Granted Patent US 9,019,759
Granted Patent B2
US 9,019,759 · App. 14/043,833 · Granted Apr 28, 2015

Techniques for providing a semiconductor memory device

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Quick Facts
Patent No.
US 9,019,759
App. No.
14/043,833
Granted
Apr 28, 2015
Kind
B2
Abstract

Techniques for providing a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a semiconductor memory device including a plurality of memory cells arranged in an array of rows and columns. Each memory cell including a first region, a second region, and a body region capacitively coupled to at least one word line and disposed between the first region and the second region. Each memory cell also including a third region, wherein the third region may be doped differently than the first region, the second region, and the body region.

Claims (24)

1. A method for biasing a semiconductor memory device comprising the steps of:

applying a first voltage potential to a first region of a first memory cell in an array of memory cells via a respective source line of the array;

applying a second voltage potential to a second region of the first memory cell via a respective bit line of the array;

applying a third voltage potential to a body region of the first memory cell via at least one respective word line of the array that is capacitively coupled to the body region; and

applying a fourth voltage potential to a third region of the first memory cell via a respective carrier injection line of the array;

wherein the first region, the second region, and the body region have a common first doping polarity.

2. The method according to claim 1 , further comprising increasing the third voltage potential applied to the at least one respective word line during a hold operation in order to perform a write logic low operation.

3. The method according to claim 1 , further comprising maintaining the first voltage potential, the second voltage potential, and the fourth voltage potential applied during a hold operation in order to perform a write logic low operation.

4. The method according to claim 1 , further comprising increasing the fourth voltage potential applied during a hold operation in order to perform a write logic high operation.

5. The method according to claim 1 , further comprising maintaining the first voltage potential, the second voltage potential, and the third voltage potential applied during a hold operation in order to perform a write logic high operation.

6. The method according to claim 1 , further comprising increasing the second voltage potential applied during a hold operation in order to perform a read operation.

7. The method according to claim 1 , further comprising increasing the third voltage potential applied during a hold operation in order to perform a read operation.

8. The method according to claim 1 , wherein the body region is disposed between the first region and the second region.

9. The method according to claim 1 , wherein the first region, the second region, and the body region have different doping concentrations.

10. The method according to claim 1 , wherein the third region has a second doping polarity that is different from the first doping polarity.

11. The method according to claim 10 , wherein the first region, the second region, and the body region are doped with donor impurities.

12. The method according to claim 11 , wherein the third region is doped with acceptor impurities.

13. The method according to claim 10 , wherein the first region, the second region, and the body region are doped with acceptor impurities.

14. The method according to claim 13 , wherein the third region is doped with donor impurities.

15. The method according to claim 1 , wherein the first region, the second region, and the body region are undoped regions.

16. The method according to claim 1 , wherein the first region, the second region, the body region, and the third region are arranged in a planar configuration.

17. The method according to claim 1 , wherein the first region, the second region, the body region, and the third region are arranged in a vertical configuration.

18. The method according to claim 17 , wherein the source line and the bit line are arranged on opposite sides of the memory cell.

19. The method according to claim 17 , wherein the word line is arranged on at least two opposing sides of the memory cell.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 1, 2016
From: MICRON TECHNOLOGY, INC
To: OVONYX MEMORY TECHNOLOGY, LLC
Reel/Frame 039974/0496 →