Interconnections for a substrate associated with a backside reveal
View Patent ↗An apparatus relating generally to a substrate is disclosed. In this apparatus, a post extends from the substrate. The post includes a conductor member. An upper portion of the post extends above an upper surface of the substrate. An exterior surface of the post associated with the upper portion is in contact with a dielectric layer. The dielectric layer is disposed on the upper surface of the substrate and adjacent to the post to provide a dielectric collar for the post. An exterior surface of the dielectric collar is in contact with a conductor layer. The conductor layer is disposed adjacent to the dielectric collar to provide a metal collar for the post, where a top surface of each of the conductor member, the dielectric collar and the metal collar have formed thereon a bond structure for interconnection of the metal collar and the conductor member.
1. An apparatus, comprising:
a post extending from a substrate;
the post including a conductor member and at least one liner layer;
an upper portion of each of the conductor member and the at least one liner layer extending above an upper surface of the substrate;
an exterior surface of the at least one liner layer of the post associated with the upper portion being in contact with a dielectric layer;
the dielectric layer being disposed on the upper surface of the substrate and adjacent to the at least one liner layer to provide a dielectric collar for the post;
an exterior surface of the dielectric collar being in contact with a conductor layer;
the conductor layer being disposed adjacent to the dielectric collar to provide a metal collar for the post; and
a top surface of each of the conductor member, the at least one liner layer, the dielectric collar and the metal collar being generally co-planar and providing a generally planar surface with a bond structure formed thereon for interconnection of the metal collar and the conductor member, and the metal collar not being in direct contact with the at least one liner layer and not being in direct contact with the conductor member of the post.
2. The apparatus according to claim 1 , wherein the conductor layer is a redistribution metal layer.
3. The apparatus according to claim 1 , wherein the post is of a through-substrate-via.
4. The apparatus according to claim 1 , wherein:
the post includes a barrier layer and a in addition to the at least one liner layer;
the barrier layer is disposed on a side surface of the conductor member; and
the at least one liner layer is disposed on a side surface of the barrier layer.