TSOP with impedance control
View Patent ↗A semiconductor device of an illustrative embodiment includes a die, a lead frame including a plurality of leads having substantial portions arranged in a lead plane and electrically connected to the die. Most preferably, the package includes at least a substantial portion of one conductive element arranged in a plane positioned adjacent the lead frame and substantially parallel to the lead plane, the conductive element being capacitively coupled to the leads such that the conductive element and at least one of the leads cooperatively define a controlled-impedance conduction path, and an encapsulant which encapsulates the leads and the conductive element. The leads and, desirably, the conductive element have respective connection regions which are not covered by the encapsulant.
1. A method of fabricating a semiconductor device comprising:
attaching a lead frame to a die, the lead frame including a plurality of leads having at least substantial portions arranged in a lead plane extending over a surface of the die;
positioning at least a substantial portion of one conductive element arranged in a plane adjacent the lead frame and substantially parallel to the lead plane such that the conductive element is capacitively coupled to the lead frame and the conductive element and at least one of the leads cooperatively define a controlled-impedance conduction path;
providing respective electrical connections between the leads and the die and the conductive elements; and
encapsulating the leads and the conductive element with an encapsulant, the device including connection regions which are not covered by the encapsulant and which are electrically connected to the leads and the conductive element, at least some of the connection regions being formed integrally with the leads,
wherein the controlled-impedance conduction path has a length of at least one millimeter.
2. A method of fabricating a semiconductor device comprising:
attaching a lead frame to a die, the lead frame including a plurality of leads having at least substantial portions arranged in a lead plane extending over a surface of the die;
positioning at least a substantial portion of one conductive element arranged in a plane adjacent the lead frame and substantially parallel to the lead plane such that the conductive element is capacitively coupled to the lead frame and the conductive element and at least one of the leads cooperatively define a controlled-impedance conduction path;
providing respective electrical connections between the leads and the die and the conductive elements; and
encapsulating the leads and the conductive element with an encapsulant, the device including connection regions which are not covered by the encapsulant and which are electrically connected to the leads and the conductive element, at least some of the connection regions being formed integrally with the leads,
wherein the substantial portion of one conductive element has a length of at least 25% of the total length of the conductive element.
3. A method of fabricating a semiconductor device comprising:
attaching a lead frame to a die, the lead frame including a plurality of leads having at least substantial portions arranged in a lead plane extending over a surface of the die;
positioning at least a substantial portion of one conductive element arranged in a plane adjacent the lead frame and substantially parallel to the lead plane such that the conductive element is capacitively coupled to the lead frame and the conductive element and at least one of the leads cooperatively define a controlled-impedance conduction path;
providing respective electrical connections between the leads and the die and the conductive elements; and
encapsulating the leads and the conductive element with an encapsulant, the device including connection regions which are not covered by the encapsulant and which are electrically connected to the leads and the conductive element, at least some of the connection regions being formed integrally with the leads,
wherein the die has a front surface and a distance between the plane of the conductive element and the lead plane is equal to or smaller than a distance between the plane of the conductive element and the front surface of the die.
4. A method of fabricating a semiconductor device comprising:
attaching a lead frame to a die, the lead frame including a plurality of leads having at least substantial portions arranged in a lead plane extending over a surface of the die;
positioning at least a substantial portion of one conductive element arranged in a plane adjacent the lead frame and substantially parallel to the lead plane such that the conductive element is capacitively coupled to the lead frame and the conductive element and at least one of the leads cooperatively define a controlled-impedance conduction path;
providing respective electrical connections between the leads and the die and the conductive elements; and
encapsulating the leads and the conductive element with an encapsulant, the device including connection regions which are not covered by the encapsulant and which are electrically connected to the leads and the conductive element, at least some of the connection regions being formed integrally with the leads,
wherein the die has a front surface and a distance between the plane of the conductive element and the lead plane is equal to or smaller than a distance between the lead plane and the front surface of the die.
5. A method of fabricating a semiconductor device comprising:
attaching a lead frame to a die, the lead frame including a plurality of leads having at least substantial portions arranged in a lead plane extending over a surface of the die;
positioning at least a substantial portion of one conductive element arranged in a plane adjacent the lead frame and substantially parallel to the lead plane such that the conductive element is capacitively coupled to the lead frame and the conductive element and at least one of the leads cooperatively define a controlled-impedance conduction path;
providing respective electrical connections between the leads and the die and the conductive elements; and
encapsulating the leads and the conductive element with an encapsulant, the device including connection regions which are not covered by the encapsulant and which are electrically connected to the leads and the conductive element, at least some of the connection regions being formed integrally with the leads,
wherein encapsulating the leads and the conductive element with an encapsulant comprises placing the device in a mold having at least two parts, closing the mold such that the parts engage each other and the connection regions, and filling a space defined by the closed mold with the encapsulant.