IP Library Granted Patent US 10,829,409
Granted Patent B2
US 10,829,409 · App. 14/053,093 · Granted Nov 10, 2020

Articles with a low-elastic modulus layer and retained strength

Inventors: Heather Bossard Decker (Arkport, NY); Shandon Dee Hart (Corning, NY); Guangli Hu (Horseheads, NY); James Joseph Price (Corning, NY); Paul Arthur Sachenik (Corning, NY)
Assignee: Corning Incorporated
C03C17/34C03C17/3417C03C17/3435C03C17/36C03C17/38C03C17/42C03C21/002G06F3/03C03C2217/425C03C2217/948Y10T428/2495Y10T428/24851Y10T428/24926Y10T428/24975Y10T428/24983Y10T428/24996Y10T428/24999
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Quick Facts
Patent No.
US 10,829,409
App. No.
14/053,093
Granted
Nov 10, 2020
Kind
B2
Abstract

One or more aspects of the disclosure pertain to an article including a film disposed on a glass substrate, which may be strengthened, where the interface between the film and the glass substrate is modified, such that the article has an improved average flexural strength, and the film retains key functional properties for its application. Some key functional properties of the film include optical, electrical and/or mechanical properties. The bridging of a crack from one of the film or the glass substrate into the other of the film or the glass substrate can be suppressed by inserting a nanoporous crack mitigating layer between the glass substrate and the film.

Claims (18)

1. An article comprising:

a glass substrate having opposing major surfaces and having a first average strain-to-failure;

a crack mitigating layer disposed on a first major surface of the glass substrate, the crack mitigating layer comprising a first elastic modulus, wherein the crack mitigating layer comprises an inorganic material; and

a film disposed on the crack mitigating layer having a second average strain-to-failure that is less than the first average strain-to-failure and a second elastic modulus that is greater than the first elastic modulus,

wherein the crack mitigating layer reduces the stress intensity factor of a crack having a stress intensity factor and originating in the film, as the crack bridges into one or more of the crack mitigating layer and the glass substrate.

2. The article of claim 1 , wherein the crack mitigating layer reduces the stress intensity factor by at least about 10%.

3. The article of claim 1 , wherein the crack mitigating layer increases the load required for the crack to bridge into the glass substrate by at least about 10%.

4. The article of claim 1 , wherein the first elastic modulus is about 50 GPa or less.

5. The article of claim 1 , wherein the inorganic material comprises a porous material.

6. The article of claim 5 , wherein the crack mitigating layer comprises a porosity in the range from about 10% by volume to about 50% by volume.

7. The article of claim 1 , wherein the film comprises a functional property selected from one or more of optical property, electrical property and mechanical property, and wherein the film substantially retains the functional property when the crack mitigating layer is disposed between the glass substrate and the film.

8. The article of claim 7 , wherein the film comprises one or more layers selected from transparent conductive oxide layers, IR reflecting layers, UV reflecting layers, conducting layers, semiconducting layers, electronics layers, thin film transistor layers, EMI shielding layers, anti-reflection layers, anti-glare layers, dirt-resistant layers, self-cleaning layers, scratch-resistant layers, barrier layers, passivation layers, hermetic layers, diffusion-blocking layers, fingerprint-resistant layers and combinations thereof.

9. The article of claim 1 , further having an average flexural strength that is substantially greater than the average flexural strength of an article comprising the glass substrate and the film but no crack mitigating layer.

10. The article of claim 1 , wherein the glass substrate is chemically strengthened and has a compressive stress greater than about 500 MPa and a compressive stress depth-of-layer greater than about 15 μm.

11. The article of claim 1 , wherein the inorganic material comprises one or more of SiO, SiO x , SiO 2 , Al 2 O 3 , AlN, AlO x N y , Si 3 N 4 , SiO x N y , SiAl x O y N z , TiO 2 , Nb 2 O 5 , Ta 2 O 5 , ZrO 2 , GeO 2 , SiC x N y , SiC x O y N z , SiC, Si, Ge, indium-tin-oxide, tin oxide, fluorinated tin oxide, aluminum zinc oxide, and zinc oxide.

12. The article of claim 11 , wherein the film comprises one or more of Al 2 O 3 , Al, AlO x N y , Si 3 N 4 , SiO x N y , SiAl x O y N z , TiO 2 , Nb 2 O 5 , Ta 2 O 5 , ZrO 2 , SiC x N y , SiC x O y N z , SiC, indium-tin-oxide, tin oxide, fluorinated tin oxide, aluminum zinc oxide, and zinc oxide.

13. The article of claim 11 , wherein the film comprises one or more layers selected from transparent conductive oxide layers, IR reflecting layers, UV reflecting layers, conducting layers, semiconducting layers, electronics layers, thin film transistor layers, EMI shielding layers, anti-reflection layers, anti-glare layers, dirt-resistant layers, self-cleaning layers, scratch-resistant layers, barrier layers, passivation layers, hermetic layers, diffusion-blocking layers, fingerprint-resistant layers and combinations thereof.

14. The article of claim 1 , wherein the film comprises indium tin oxide.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 11, 2014
From: DECKER, HEATHER BOSSARD; HART, SHANDON DEE; HU, GUANGLI; PRICE, JAMES JOSEPH; SACHENIK, PAUL ARTHUR
To: CORNING INCORPORATED
Reel/Frame 033073/0611 →
Continuity (3)
Provisional Application 61820395 · May 7, 2013
Provisional Application 61712908 · Oct 12, 2012
Related Publication 20140106150A1 · Apr 17, 2014