Backside illuminated image sensor and manufacturing method thereof
Disclosed is a backside illuminated image sensor including a light receiving element formed in a first substrate, an interlayer insulation layer formed on the first substrate including the light receiving element, a via hole formed through the interlayer insulation layer and the first substrate while being spaced apart from the light receiving element, a spacer formed on an inner sidewall of the via hole, an alignment key to fill the via hole, interconnection layers formed on the interlayer insulation layer in a multilayer structure in which a backside of a lowermost layer of the interconnection layers is connected to the alignment key, a passivation layer covering the interconnection layers, a pad locally formed on a backside of the first substrate and connected to a backside of the alignment key, and a color filter and a microlens formed on the backside of the first substrate corresponding to the light receiving element.
1. A method for manufacturing an image sensor, the method comprising:
forming a light-receiving element in a first side of a first substrate;
forming an interlayer insulation layer over the first side of the first substrate and the light-receiving element;
etching the interlayer insulation layer and first substrate to form a via hole through the interlayer insulation layer and the first substrate;
forming a spacer on an inner sidewall of the via hole;
forming an adhesive layer along an inner surface of the via hole;
forming a barrier layer along the inner surface of the via hole after said forming a spacer;
filling the via hole with conductive material to form an alignment key on the barrier layer;
forming interconnection layers on the interlayer insulation layer and the alignment key;
bonding a second substrate to the first side of the first substrate via the interconnection layers;
exposing the alignment key on a second side of the first substrate that is opposite the first side of the first substrate; and
forming a pad on the second side of the first substrate that is coupled to the alignment key.
2. The method of claim 1 , further comprising forming both a color filter and a microlens on the second side of the first substrate, wherein the color filter and microlens are configured to direct light toward the light-receiving element.
3. A method for manufacturing an image sensor, the method comprising:
forming a light-receiving element in a first side of a first substrate;
forming an interlayer insulation layer over the first side of the first substrate and the light-receiving element;
etching the interlayer insulation layer and first substrate to form a via hole through the interlayer insulation layer and the first substrate;
forming a spacer on an inner sidewall of the via hole;
forming a barrier layer along an inner surface of the via hole after said forming a spacer;
filling the via hole with conductive material to form an alignment key on the barrier layer;
forming interconnection layers on the interlayer insulation layer and the alignment key;
bonding a second substrate to the first side of the first substrate via the interconnection layers;
exposing the alignment key on a second side of the first substrate that is opposite the first side of the first substrate; and
forming a pad on the second side of the first substrate that is coupled to the alignment key;
wherein said exposing the alignment key includes back-grinding the second side of the first substrate and etching a buried oxide layer on the second side of the first substrate to expose the alignment key.
4. The method of claim 1 , wherein said forming a barrier layer comprises forming a barrier layer selected from the group consisting of Ti, TiN, Ta, TaN, AlSiTiN, NiTi, TiBN, ZrBN, TiAlN, TiB2, Ti/TiN, and Ta/TaN.
5. The method of claim 1 , further comprising forming an anti-light scattering layer on the second side of the first substrate.
6. The method of claim 3 , further comprising forming an adhesive layer along the inner surface of the via hole.
7. A method for manufacturing an image sensor, the method comprising:
forming a light-receiving element in a first side of a first substrate;
forming an interlayer insulation layer over the first side of the first substrate and the light-receiving element;
etching the interlayer insulation layer and first substrate to form a via hole through the interlayer insulation layer and the first substrate;
forming a spacer on an inner sidewall of the via hole;
forming a barrier layer along an inner surface of the via hole after said forming a spacer;
filling the via hole with conductive material to form an alignment key on the barrier layer;
forming interconnection layers on the interlayer insulation layer and the alignment key;
bonding a second substrate to the first side of the first substrate via the interconnection layers;
exposing the alignment key on a second side of the first substrate that is opposite the first side of the first substrate; and
forming a pad on the second side of the first substrate that is coupled to the alignment key; and
removing a region of a buried oxide layer formed on the second side of the first substrate, wherein the region corresponds to the light-receiving element.
8. The method of claim 1 , further comprising forming a passivation layer over the interconnection layers prior to said bonding a second substrate to the first side of the first substrate.
9. The method of claim 6 , further comprising removing a region of a buried oxide layer formed on the second side of the first substrate, wherein the region corresponds to the light-receiving element.
10. The method of claim 7 , wherein said exposing the alignment keys comprises:
back-grinding the second side of the first substrate; and
etching a buried oxide layer on the second side of the first substrate to expose the alignment keys.
11. The method of claim 1 , further comprising:
forming a drain region in the first side of the first substrate;
etching the interlayer insulation layer to form a contact hole through the interlayer insulation to the drain region;
forming a barrier layer along an inner surface of the contact hole; and
filling the contact hole with conductive material to form a contact plug.
12. A method for manufacturing an image sensor, the method comprising:
forming a light-receiving element in a first side of a first substrate;
forming an interlayer insulation layer over the first side of the first substrate and the light-receiving element;
etching the interlayer insulation layer and first substrate to form a plurality of via holes through the interlayer insulation layer and the first substrate;
forming a spacer on an inner sidewall of each via hole of the plurality of via holes;
forming an adhesive layer along an inner surface of each via hole of the plurality of via holes;
forming a barrier layer along the inner surface of each via hole of the plurality of via holes after said forming a spacer;
filling each via hole of the plurality of via holes with conductive material to form an alignment key on the barrier layer of each via hole;
forming interconnection layers on the interlayer insulation layer and the alignment keys;
bonding a second substrate to the first side of the first substrate via the interconnection layers;
exposing the alignment keys on a second side of the first substrate that is opposite the first side of the first substrate; and
forming a pad on the second side of the first substrate that is coupled to the alignment keys.
13. The method of claim 12 , further comprising forming both a color filter and a microlens on the second side of the first substrate, wherein the color filter and microlens are configured to direct light toward the light-receiving element.
14. The method of claim 12 , wherein said forming a barrier layer comprises forming a barrier layer selected from the group consisting of Ti, TiN, Ta, TaN, AlSiTiN, NiTi, TiBN, ZrBN, TiAlN, TiB2, Ti/TiN, and Ta/TaN.
15. The method of claim 12 , further comprising forming an anti-light scattering layer on the second side of the first substrate.
16. The method of claim 12 , wherein said exposing the alignment keys comprises:
back-grinding the second side of the first substrate; and
etching a buried oxide layer on the second side of the first substrate to expose the alignment keys.
17. The method of claim 12 , further comprising removing a region of a buried oxide layer formed on the second side of the first substrate, wherein the region corresponds to the light-receiving element.
18. The method of claim 12 , further comprising forming a passivation layer over the interconnection layers prior to said bonding a second substrate to the first side of the first substrate.
19. The method of claim 12 , further comprising:
forming a plurality of drain regions in the first side of the first substrate;
etching the interlayer insulation layer and first substrate to form a plurality of
contact holes through the interlayer insulation to one or more of the plurality of drain regions;
forming a barrier layer along an inner surface of each contact hole of the plurality of contact holes; and
filling each contact hole of the plurality of contact holes with conductive material.