IP Library Granted Patent US 9,184,670
Granted Patent B2
US 9,184,670 · App. 14/057,494 · Granted Nov 10, 2015

Power conversion device

Inventors: Mitsuharu Matsuno (Aichi-ken, JP); Hiroshi Inamura (Nagoya, JP); Akira Nakasaka (Kariya, JP)
Assignee: DENSO CORPORATION
H02M7/003
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Quick Facts
Patent No.
US 9,184,670
App. No.
14/057,494
Granted
Nov 10, 2015
Kind
B2
Abstract

A power conversion device comprises a main circuit section that has a semiconductor module with a switching element therein and including a main electrode terminal, a capacitor with a capacitor element therein and that includes a capacitor terminal, and a bus bar that connects the main electrode terminal and the capacitor terminal. The capacitor terminal extends from a capacitor main body including the capacitor element therein towards the main circuit section. The bus bar provides a bending section on a base end side of a connecting section between the bus bar and the capacitor terminal. The bus bar and the capacitor terminal are connected such as to overlap in a state in which respective tip directions match.

Claims (54)

1. A power conversion device comprising:

a main circuit section that has a semiconductor module incorporating a switching element and including a main electrode terminal;

a capacitor that incorporates a capacitor element and includes a capacitor terminal; and

a bus bar that connects between the main electrode terminal and the capacitor terminal, wherein:

the capacitor terminal is extended toward the main circuit section from a capacitor body incorporating the capacitor element;

at least one of the bus bar and the capacitor terminal includes a bending portion on a base end side of a connecting section between the both;

the bus bar and the capacitor terminal are overlapped with each other in a state where each other's tip directions are coincided;

the bending portion is formed in the bus bar;

a tip direction of the connecting section is parallel to a lining direction of the main circuit section and the capacitor;

the main circuit section includes a plurality of the semiconductor modules;

the bus bar includes a positive bus bar and a negative bus bar;

the bus bar includes a bus bar terminal configuring the connecting section, a main circuit connecting portion connected to the main electrode terminals of the plurality of semiconductor modules, and a connecting portion connecting between the main circuit connecting portion and the bus bar terminal;

the main circuit connecting portion of the positive bus bar and the main circuit connecting portion of the negative bus bar are arranged so as to be opposite to each other;

the bus bar terminal is folded back from the connecting portion toward the main circuit section via the bending portion; and

the connecting portion of the positive bus bar and the connecting portion of the negative bus bar are arranged between the capacitor and the main circuit section in a lining direction of the capacitor and the main circuit section, while being arranged so as to be opposed to each other in the lining direction.

2. The power conversion device according to claim 1 , wherein

the bus bar is partially sealed by a resin mold portion, and

the bending portion is exposed from the resin mold portion.

3. The power conversion device according to claim 1 , wherein

the capacitor body has a capacitor case having an open surface on one side and accommodating therein the capacitor element and a sealing resin that seals the capacitor element,

the capacitor terminal is projected from the open surface, and

the capacitor is arranged such that the open surface of the capacitor case is directed toward the main circuit section.

4. The power conversion device according to claim 2 , wherein

the capacitor body has a capacitor case having an open surface on one side and accommodating therein the capacitor element and a sealing resin that seals the capacitor element,

the capacitor terminal is projected from the open surface, and

the capacitor is arranged such that the open surface of the capacitor case is directed toward the main circuit section.

5. The power conversion device according to claim 1 , wherein

the main circuit section includes a stacked body in which the semiconductor modules and a plurality of cooling members cooling each of the semiconductor modules from both main surfaces thereof are alternately stacked and arranged, and

the capacitor is arranged on one end side of the stacked body in a stacking direction, relative to the main circuit section.

6. The power conversion device according to claim 2 , wherein

the main circuit section includes a stacked body in which the semiconductor modules and a plurality of cooling members cooling each of the semiconductor modules from both main surfaces thereof are alternately stacked and arranged, and

the capacitor is arranged on one end side of the stacked body in a stacking direction, relative to the main circuit section.

7. The power conversion device according to claim 3 , wherein

the main circuit section includes a stacked body in which the semiconductor modules and a plurality of cooling members cooling each of the semiconductor modules from both main surfaces thereof are alternately stacked and arranged, and

the capacitor is arranged on one end side of the stacked body in a stacking direction, relative to the main circuit section.

8. The power conversion device according to claim 4 , wherein

the main circuit section includes a stacked body in which the semiconductor modules and a plurality of cooling members cooling each of the semiconductor modules from both main surfaces thereof are alternately stacked and arranged, and

the capacitor is arranged on one end side of the stacked body in a stacking direction, relative to the main circuit section.

9. The power conversion device according to claim 1 , wherein

the positive bus bar and the negative bus bar are integrated by the resin mold portion that partially seals these bus bars.

10. The power conversion device according to claim 2 , wherein

the positive bus bar and the negative bus bar are integrated by the resin mold portion that partially seals these bus bars.

11. The power conversion device according to claim 3 , wherein

the positive bus bar and the negative bus bar are integrated by the resin mold portion that partially seals these bus bars.

12. The power conversion device according to claim 4 , wherein

the positive bus bar and the negative bus bar are integrated by the resin mold portion that partially seals these bus bars.

13. The power conversion device according to claim 5 , wherein

the positive bus bar and the negative bus bar are integrated by the resin mold portion that partially seals these bus bars.

14. The power conversion device according to claim 6 , wherein

the positive bus bar and the negative bus bar are integrated by the resin mold portion that partially seals these bus bars.

15. The power conversion device according to claim 7 , wherein

the positive bus bar and the negative bus bar are integrated by the resin mold portion that partially seals these bus bars.

16. The power conversion device according to claim 8 , wherein

the positive bus bar and the negative bus bar are integrated by the resin mold portion that partially seals these bus bars.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2013
From: MATSUNO, MITSUHARU; INAMURA, HIROSHI; NAKASAKA, AKIRA
To: DENSO CORPORATION
Reel/Frame 031435/0896 →
Priority Claims (1)
JP 2012-237936 · Oct 29, 2012 · national
Continuity (1)
Related Publication 20140118909A1 · May 1, 2014