CORRECTION APPARATUS, PROBE APPARATUS, AND TEST APPARATUS

1 . A correction apparatus that corrects misalignment of a transported object at a transport destination, comprising:

a first sensor that is secured to a transporting section transporting the object; and

a correction control section that detects a first offset between the transporting section and the first sensor, while the object transported to the transport destination is positioned at the transport destination, by using the first sensor to detect a position of a first reference point provided to correspond to a target position at the transport destination.

2 . The correction apparatus according to claim 1 , further comprising a second sensor that is secured to the first reference point, wherein

the object is mounted on one surface of the transporting section from outside, and

the correction control section uses the second sensor to detect a second offset between the object and a position of a second reference point provided on the one surface and secured to the transporting section.

3 . The correction apparatus according to claim 2 , wherein

with one object transported to the transport destination being connected to the transport destination and with a following object not yet received by the transporting section, the correction control section detects the first offset.

4 . The correction apparatus according to claim 2 , wherein

the correction control section detects the second offset by detecting a position of the second reference point and a predetermined reference point of the object.

5 . The correction apparatus according to claim 2 , wherein

the correction control section corrects the misalignment at the transport destination based on a result of a detection of a position of the first reference point using the first sensor, in response to change of the first offset exceeding a reference change amount.

6 . The correction apparatus according to claim 5 , wherein

the correction control section omits detection of the second offset when the detected change of the first offset is less than or equal to the reference change amount in series for greater than or equal to a reference number of times.

7 . The correction apparatus according to claim 5 , wherein

the correction control section omits detection of the first reference point when the detected change of the first offset is less than or equal to the reference change amount in series for greater than or equal to a reference number of times.

8 . The correction apparatus according to claim 2 , comprising:

a storage section that stores the first offset detected by the correction control section; and

an updating section that, when change of the first offset exceeds a reference change amount, updates the first offset stored in the storage section to be the first offset detected by the correction control section.

9 . The correction apparatus according to claim 2 , wherein

the first sensor includes a first image capturing section and the second sensor includes a second image capturing section, and

the correction control section detects the first offset based on a result of image capturing of one of the first image capturing section and the second image capturing section by the other of the first image capturing section and the second image capturing section.

10 . The correction apparatus according to claim 2 , wherein

the second sensor further includes a light source section that outputs light, and

the correction control section detects the first offset according to reception of light output from the second sensor by the first sensor.

11 . The correction apparatus according to claim 2 , wherein

the first sensor further includes a light source section that outputs light, and

the correction control section detects the first offset according to reception of light output from the first sensor by the second sensor.

12 . The correction apparatus according to claim 2 , wherein

the object includes a semiconductor wafer having a plurality of electrodes formed thereon, and

the second sensor is a wafer camera that captures an image of the second reference point and a predetermined reference point on the semiconductor wafer.

13 . The correction apparatus according to claim 1 , wherein

the transporting section transports a plurality of the objects respectively to a plurality of the transport destinations.

14 . A probe apparatus comprising the correction apparatus according to claim 1 , wherein

the object is a semiconductor wafer on which a plurality of electrodes are formed and a wafer tray on which the semiconductor wafer is mounted,

the transport destination is a wafer station that includes:

a holding section that holds the wafer tray; and

a probe card that is electrically connected to the electrodes formed on the semiconductor wafer, and

a first offset between the transporting section and the first sensor is detected while the wafer tray is held by the holding section.

15 . The probe apparatus according to claim 14 , comprising a plurality of the wafer stations, wherein

the first sensor includes a plurality of probe cameras that detect a position of each first reference point, and a plurality of first reference points being provided to each of a plurality of the probe cards.

16 . A test apparatus that tests a plurality of devices under test formed on a semiconductor wafer, comprising:

a test section that tests the devices under test by exchanging electrical signals with the devices under test; and

the probe apparatus of claim 14 that is electrically connected to electrodes of each of the devices under test.

17 . The test apparatus according to claim 16 , further comprising a transmitting section that is connected to the test section and transmits a start signal causing the correction control section to begin detecting the first offset, wherein

the transmitting section transmits the start signal before testing of one or more of the test devices formed on one semiconductor wafer is finished.