CMP head structure
View Patent ↗A CMP structure for CMP processing and a method of making a device using the same are presented. The apparatus comprises a polishing pad on a platen table; a head assembly for holding a wafer against the polishing pad, wherein the head assembly includes the retaining ring; a sensor for sensing the step height between the retaining ring and its membrane and a controller for adjusting the movement of the retaining ring based on the step height between the retaining ring and its membrane to ensure the step height remains at a fixed value as the retaining ring wears out.
1. A method for prolonging the use of a retaining ring comprising:
providing a head assembly for use in polishing a wafer, wherein the head assembly includes a retaining ring for holding the wafer in place on a polishing pad;
determining a step height between the retaining ring and a membrane of the retaining ring;
calculating how much the retaining ring should be moved to ensure the step height between the retaining ring and the membrane remains at a fixed value; and
moving the retaining ring to ensure the step height remains at the fixed value as the retaining ring wears out.
2. The method of claim 1 wherein the step height comprises a first dimension before processing and the retaining ring is moved to ensure the step height remains at the first dimension throughout the retaining ring life span.
3. The method of claim 1 further comprising moving the retaining ring forward to ensure the step height remains at the first dimension.
4. The method of claim 1 wherein a controller activates a mechanism to move the retaining ring to ensure the step height remains at the fixed value.
5. The method of claim 4 wherein the mechanism comprises gears located around the circumference of the retaining ring.
6. The method of claim 5 further comprising setting the gears in drive mode at fixed intervals before processing.
7. The method of claim 1 wherein a controller calculates how much the retaining ring should be moved and activates a mechanism to move the retaining ring to ensure the step height remains at the fixed value.
8. The method of claim 1 wherein the calculating step further comprises
receiving the measurement of the step height in the form of a digital signal;
forwarding the digital signal to a control kit that calculates the adjustment needed to keep the step height to a fixed value;
receiving the calculation of the adjustment needed from the control kit; and
activating a mechanism to move the retaining ring so the step height remains at the fixed value throughout the retaining ring life span.
9. A method for forming a device comprising:
providing a wafer;
processing the wafer, wherein processing the wafer includes
providing a head assembly for use in polishing the wafer, wherein the head assembly includes a retaining ring for holding the wafer in place on a polishing pad,
determining a step height between the retaining ring and a membrane of the retaining ring, and
calculating how much the retaining ring should be moved to ensure the step height between the retaining ring and the membrane remains at a fixed value, and
moving the retaining ring to ensure the step height remains at the fixed value.
10. The method of claim 9 wherein the step height is of a first dimension before processing and the retaining ring is moved to ensure the step height remains at the first dimension as the retaining ring wears out.
11. The method of claim 10 further comprising moving the retaining ring forward to ensure the step height remains at the first dimension throughout the retaining ring life span.
12. The method of claim 9 wherein the calculating step further comprises:
receiving measurement of the step height in the form of a digital signal;
forwarding the digital signal to a control kit that calculates the adjustment needed to keep the step height to a fixed value;
receiving the calculation of the adjustment needed from the control kit; and
activating a mechanism to move the retaining ring so the step height remains at the fixed value throughout the retaining ring life span.
13. The method of claim 9 wherein determining the step height is achieved by measuring the step height using a sensor or a plurality of sensors installed at a head cup load unload (HCLU).
14. The method of claim 13 wherein the calculation step further comprises:
receiving measurement of the step height by a step height data controller from the HCLU in the form of a digital signal;
forwarding the digital signal to a control kit that calculates the adjustment needed to keep the step height to a fixed value;
receiving the calculation of the adjustment needed from the control kit; and
activating the step height data controller to adjust the retaining ring movement.
15. The method of claim 14 wherein the controller activates a mechanism for adjusting the step height to ensure it remains at the fixed value.
16. The method of claim 15 wherein the mechanism comprises gears located around the circumference of the retaining ring.
17. The method of claim 16 wherein the gears are set to be in drive mode at fixed intervals while processing takes place.
18. The method of claim 9 wherein the retaining ring comprises unfilled polyphenylene sulfide or unfilled polycarbonate which encapsulates a stainless steel ring.
19. The method of claim 9 wherein:
providing the wafer comprises loading the wafer onto a chemical mechanical polishing (CMP) tool; and
determining the step height is performed before or after loading the wafer.
20. The method of claim 1 wherein the retaining ring comprises unfilled polyphenylene sulfide or unfilled polycarbonate which encapsulates a stainless steel ring.