Method for manufacturing nitride semiconductor device
Forming a group III nitride semiconductor layer having p-type conductivity on at least one layer or more formed on an Si substrate or sapphire substrate using at least one of an epitaxial growth or ion implantation method. When forming the group III nitride semiconductor layer, at least one type of metal element selected from Zn, Li, Au, Ag, Cu, Pt, and Pd having a formation energy of a group III element substitute higher than that of Mg is doped simultaneously with Mg of a p-type dopant to introduce an interstitial site. Subsequent to activation of Mg as an acceptor, the metal element is removed from the group III nitride semiconductor layer, and the concentration of the metal element is not more than 1/100 of the concentration of Mg to realize a hole concentration of not less than 10 18 to 10 19 cm −3 .
1. A method for manufacturing a nitride semiconductor device having a substrate and a group III nitride semiconductor layer having p-type conductivity on at least one layer or more formed on the substrate,
the method comprising forming the group III nitride semiconductor layer having the p-type conductivity by simultaneously doping magnesium of a p-type dopant and a metal element having a formation energy of a group III element substitute higher than that of the magnesium and introducing the metal element to an interstitial site in the group III nitride semiconductor layer,
wherein the metal element is at least one type of element selected from Zn, Au, Ag, Cu, Pt, and Pd.
2. The method for manufacturing a nitride semiconductor device according to claim 1 , wherein the metal element is removed from the group III nitride semiconductor layer at the time of activating the magnesium as an acceptor or thereafter, and a concentration of the metal element in the group III nitride semiconductor layer is not more than 1/100 of the concentration of the magnesium in the group III nitride semiconductor layer.
3. The method for manufacturing a nitride semiconductor device according to claim 2 , wherein the process for removing the metal element from the group III nitride semiconductor layer is a heat treatment process.
4. The method for manufacturing a nitride semiconductor device according to claim 3 , wherein, in the heat treatment process, the substrate is cooled to form a temperature gradient in the nitride semiconductor device.
5. The method for manufacturing a nitride semiconductor device according to claim 1 , wherein the metal element is at least one type of element selected from Au, Ag, Cu, Pt, and Pd.
6. The method for manufacturing a nitride semiconductor device according to claim 1 , wherein the group III nitride semiconductor layer having the p-type conductivity is any one of GaN, AlN, or InN, or a mixed crystal composed of a combination of any two types selected from GaN, AlN, and InN.
7. The method for manufacturing a nitride semiconductor device according to claim 1 , wherein the nitride semiconductor device is a rectifier diode, field effect transistor, or light emitting device.