Devices and methods of operation for separating semiconductor die from adhesive tape
View Patent ↗The embodiments described herein provide an apparatus and method for separating dies from adhesive tape. In general, these techniques use applied vacuum and one or more channels in an extractor base surface to progressively peel adhesive tape away from the die. When the adhesive tape has been peeled away from the entire die the die can be removed and packaged. Such a technique can reduce the strain the die and thus may reduce the probability of cracks occurring in the die, and is thus particularly applicable to removing adhesive tape from relatively thin dies.
1. An apparatus for separating a plurality of semiconductor dies from an adhesive tape, comprising:
an extractor base having a surface for supporting the plurality of semiconductor dies attached to the adhesive tape, wherein the surface includes at least a first channel, the first channel including at least a first vacuum opening, the first channel arranged in the surface, wherein the extractor base further includes a second channel, the second channel including at least a second vacuum opening, the first channel and the second channel positioned in a non-parallel arrangement in the surface such that spacing between channels narrows along a first direction, and wherein the extractor base further includes a third channel in the surface, the third channel positioned between the first channel and the second channel.
2. The apparatus of claim 1 further comprising a vacuum source coupled to the first vacuum opening and the second vacuum opening such that the adhesive tape under a die passing over the surface along the first direction is progressively peeled away by the vacuum.
3. The apparatus of claim 1 further comprising a fourth channel and a fifth channel in the surface, wherein the fourth channel and the fifth channel are positioned in a non-parallel arrangement in the surface such that spacing between channels widens along the first direction.
4. The apparatus of claim 1 further comprising a fourth channel and a fifth channel in the surface, wherein the fourth channel and the fifth channel are positioned in a non-parallel arrangement in the surface such that spacing between channels narrows along the first direction.
5. The apparatus of claim 1 further comprising an X-Y table configured to move the plurality of semiconductor dies over the surface.
6. The apparatus of claim 1 further comprising a heating element configured to heat the surface of the extractor base.
7. The apparatus of claim 1 further comprising one or more demount openings in the surface configured to apply vacuum to the adhesive tape during die pickup.
8. The apparatus of claim 1 wherein the apparatus does not include an ejector pin for separating a die from the adhesive tape.
9. The apparatus of claim 1 wherein the adhesive tape is separated using only vacuum through the extractor base to pull the adhesive tape from the plurality of semiconductor dies.
10. An apparatus for separating a plurality of semiconductor dies from an adhesive tape, comprising:
an extractor base having a surface for supporting the plurality of semiconductor dies attached to the adhesive tape, wherein the surface includes at least a first channel, a second channel, and a third channel, the first channel including at least a first vacuum opening and the second channel including at least a second vacuum opening, the first channel and the second channel positioned in a non-parallel arrangement in the surface such that spacing between channels narrows along a first direction, the third channel positioned between the first channel and the second channel, the first channel and the second channel further positioned such that a first outer edge of a die passing over the surface along the first direction encounters the first channel and a second outer edge opposite the first outer edge encounters the second channel; and
a vacuum source coupled to the first vacuum opening and the second vacuum opening such that the adhesive tape under the die passing over the surface along the first direction is progressively peeled away by the vacuum.
11. A method for separating semiconductor dies from an adhesive tape, comprising:
positioning a die on a surface of an extractor base, the surface supporting the die and the adhesive tape and including at least a first channel and a second channel, the first channel including at least a first vacuum opening and the second channel including at least a second vacuum opening, the first channel and the second channel positioned in a non-parallel arrangement in the surface such that spacing between channels narrows along a first direction;
moving the die across the surface in the first direction such that a first outer edge of the die encounters the first channel and a second outer edge opposite the first outer edge encounters the second channel; and
continuing to move the die across the surface in the first direction to progressively peel away the adhesive tape with vacuum applied to the first vacuum opening and the second vacuum opening.
12. The method of claim 11 wherein the step of moving the die comprising moving the die with an X-Y table.
13. The method of claim 11 wherein the surface further includes a third channel and a fourth channel, wherein the third channel and the fourth channel are positioned in a non-parallel arrangement in the surface such that spacing between channels widens along the first direction.
14. The method of claim 11 wherein the surface further comprises a third channel and a fourth channel in the surface, wherein the third channel and the fourth channel are positioned in a non-parallel arrangement in the surface such that spacing between channels narrows along the first direction.
15. The method of claim 11 further comprising heating the surface of the extractor base.
16. The method of claim 11 further comprising picking up the die while applying vacuum to the adhesive tape through one or more demount openings in the surface.
17. The method of claim 11 wherein the extractor base does not include an ejector pin for separating a die from the adhesive tape.