IP Library Granted Patent US 9,197,797
Granted Patent B2
US 9,197,797 · App. 14/067,960 · Granted Nov 24, 2015

Camera module

Inventors: Guo-Hua Duan (Shenzhen, CN); Fu-Chun Li (Shenzhen, CN); Yong Li (Shenzhen, CN); Yu-Shu Lin (New Taipei, TW); Shu-Sheng Peng (Shenzhen, CN); Wen-Hsiung Chen (New Taipei, TW); Shin-Wen Chen (New Taipei, TW)
Assignees: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.; HON HAI PRECISION INDUSTRY CO., LTD.
H04N5/2253H04N5/2252H04N5/2257H01L2924/3025
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Quick Facts
Patent No.
US 9,197,797
App. No.
14/067,960
Granted
Nov 24, 2015
Kind
B2
Abstract

A camera module includes an image sensor, a circuit board, and a stiffener. The stiffener is located one side of the circuit board and includes a bottom plate grounded. The image sensor is located on another side of the circuit board. The stiffener includes a sidewall extending from the bottom plate. The sidewall and the bottom plate cooperatively hold the circuit board. An insulative coating is coated on the sidewall to avoid short circuiting.

Claims (12)

1. A camera module, comprising:

an image sensor;

a circuit board; and

a stiffener located on one side of the circuit board, the stiffener comprising a bottom plate configured for being grounded, the image sensor located on another side of the circuit board, wherein the stiffener comprises at least one sidewall extending from the bottom plate, the at least one sidewall and the bottom plate cooperatively hold the circuit board, the stiffener comprises an insulative coating coated on the at least one sidewall of the stiffener to avoid short circuiting;

wherein the at least one sidewall comprises three sidewalls, the three sidewalls extend from three sides of the bottom plate in the same direction, all the three sidewalls have a same height, the three sidewalls define an opening, the circuit board protrudes out of the stiffener from the opening, and the insulative coating is coated on an inner surface of each sidewall.

2. The camera module of claim 1 , comprising a lens module, the lens module located on the circuit board and covering the image sensor.

3. The camera module of claim 1 , comprising a conductive adhesive, the conductive adhesive positioned on the bottom plate of the stiffener to make the stiffener connect with the circuit board.

4. The camera module of claim 3 , wherein the conductive adhesive is anisotropic conductive film.

5. The camera module of claim 1 , wherein the material of the insulative coating is printing ink.

6. The camera module of claim 1 , wherein the material of the stiffener is selected from the group consisting of copper, copper alloy, and plastic.

7. The camera module of claim 1 , wherein the bottom plate is in a square shape.

8. The camera module of claim 1 , wherein the bottom plate is in a circular shape.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2019
From: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.; HON HAI PRECISION INDUSTRY CO., LTD.
To: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Reel/Frame 049312/0264 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2014
From: DUAN, GUO-HUA; LI, FU-CHUN; LI, YONG; LIN, YU-SHU; PENG, SHU-SHENG; CHEN, WEN-HSIUNG; CHEN, SHIN-WEN
To: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.; HON HAI PRECISION INDUSTRY CO., LTD.
Reel/Frame 033440/0800 →
Priority Claims (1)
CN 2013 1 02925835 · Jul 12, 2013 · national
Continuity (1)
Related Publication 20150015779A1 · Jan 15, 2015