Connection verification technique
View Patent ↗Some embodiments of the present invention are generally directed to testing connections of a memory device to a circuit board or other device. In one embodiment, a memory device that is configured to facilitate continuity testing between the device and a printed circuit board or other device is disclosed. The memory device includes a substrate and two connection pads that are electrically coupled to one another via a test path. A system and method for testing the connections between a memory device and a circuit board or other device are also disclosed, as are additional techniques for detecting excess temperature and enabling special functionalities using multi-stage connection pads.
1. A method for efficiently testing interconnects of electronics comprising:
positioning a plurality of solder balls between a plurality of first connection pads on a first substrate and a plurality of second connection pads on a second substrate, wherein either the plurality of first connection pads or the plurality of second connection pads comprises a plurality of multi-stage connection pads each including an inner conductive pad and an outer conductive pad positioned concentrically about the inner conductive pad, such that the inner and outer conductive pads are electrically isolated from one another; and
heating the plurality of solder balls such that each respective one of the plurality of solder balls electrically couples a respective one of the plurality of first connections pads to a respective one of the second plurality of connection pads, and such that each respective one of the plurality of solder balls establishes an electrical connection between the inner and outer conductive pads of each of the plurality multi-stage connection pads.
2. The method of claim 1 , wherein the inner conductive pad and the outer conductive pad of each of the plurality of multi-stage connection pads comprises a primary connection pad and a target connection pad, respectively.
3. The method of claim 2 , wherein heating the plurality solder balls includes heating the plurality of solder balls such that each of the plurality solder balls establishes an electrical connection between a respective one of the primary connection pads and a respective one of the target connection pads.
4. The method of claim 1 , wherein each of the plurality of multi-stage connection pads comprises at least two electrically isolated conductive regions, and wherein heating the plurality of solder balls forms an electrically conductive path between the at least two electrically isolated conductive regions.
5. The method of claim 1 , wherein each of the plurality of first connection pads and each of the plurality of second connection pads comprises a plurality of multi-stage connection pads.
6. The method of claim 1 , comprising electrically testing an outer stage of each of the plurality of multi-stage connection pads to verify electrical connection between the first substrate and the second substrate.
7. The method of claim 1 , comprising electrically testing an outer stage of each of the plurality of multi-stage connection pads to identify excessive heating of each of the plurality of solder balls.
8. The method of claim 1 , wherein heating the plurality of solder balls enables additional functionality of a memory device coupled to one of the first substrate or the second substrate.
9. The method of claim 1 , wherein heating the plurality of solder balls electrically couples an outer stage of at least one of the plurality of multi-stage connection pads to additional circuitry on one of the first substrate or the second substrate.
10. The method of claim 1 , wherein each of the plurality of multi-stage connection pads comprises three electrically isolated conductive regions.
11. The method of claim 1 , wherein positioning comprises positioning the plurality of solder balls such that the plurality of solder balls are not in contact with the outer conductive pads before heating.
12. A method for efficiently testing interconnects of electronics comprising:
positioning a solder ball between a first connection pad of a first substrate and a second connection pad of a second substrate, wherein at least one of the first connection pad or the second connection pad comprising a multi-stage connection pad having multiple conductive pads electrically isolated from one another, wherein each of the multiple conductive pads is disposed on a non-conductive surface of the first substrate or the second substrate; and
heating the solder ball to adhere the first connection pad to the second connection pad, and wherein heating the solder ball deforms the solder ball to establish an electrical connection between the multiple conductive pads of the multi-stage connection pad.
13. The method of claim 12 , wherein each multi-stage connection pad having multiple conductive pads comprises an inner conductive pad completely surrounded by an outer conductive pad that is electrically isolated from the inner conductive pad.
14. The method of claim 12 , wherein positioning comprises positioning the solder ball on the multi-stage pad such that the solder ball is only in contact with one of the multiple conductive pads before heating.
15. The method of claim 12 , comprising identifying excessive heating of the solder ball by detecting that the solder ball has deformed such that an electrical connection has been established between the multiple conductive pads of the multi-stage connection pad.
16. The method of claim 12 , wherein the multi-stage connection pad comprises an inner conductive pad and an outer conductive pad surrounding the inner conductive pad, wherein heating the solder ball deforms the solder ball to establish an electrical connection between the inner conductive pad and the outer conductive pad.
17. The method of claim 16 , comprising testing the outer conductive pad to determine whether an electrically conductive path is established between the first substrate and the second substrate, after heating the solder ball.
18. The method of claim 12 , wherein heating the solder ball to establish electrical connection between the multiple conductive pads enables additional functionality through an electrical path connecting circuitry to an outer stage of the multi-stage connection pad.
19. The method of claim 18 , wherein heating the solder ball to establish electrical connection between the multiple conductive pads enables additional functionality through an electrical path connecting a memory device to an outer stage of the multi-stage connection pad.